Attention-Based Deep Learning for Multi-Target Prediction of Process Time and Tool Availability in Large-Scale Semiconductor Fabs

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
T. E. Korabi;G. Goossen;A. Kaushik;J. van Heugten;A. Raghuvanshi;J. Bédorf;S. Chakravorty;D. Pabst;S. Ramakrishnan;J. DeLong;T. Hewlett;A. Ang;A. Wong;K. Soh;S. Velasquez;H. Mogra
{"title":"Attention-Based Deep Learning for Multi-Target Prediction of Process Time and Tool Availability in Large-Scale Semiconductor Fabs","authors":"T. E. Korabi;G. Goossen;A. Kaushik;J. van Heugten;A. Raghuvanshi;J. Bédorf;S. Chakravorty;D. Pabst;S. Ramakrishnan;J. DeLong;T. Hewlett;A. Ang;A. Wong;K. Soh;S. Velasquez;H. Mogra","doi":"10.1109/TSM.2026.3706122","DOIUrl":null,"url":null,"abstract":"Precise prediction of processing time (PT) and machine availability is critical for optimizing fabrication throughput. This paper presents a generalized, attention-based deep neural network designed to capture non-linear tool dynamics and high-dimensional categorical dependencies. Unlike rigid statistical baselines, our framework adapts to multiple prediction targets, including equipment-level process completion and granular chamber-level availability. Deployed in multiple GlobalFoundries semiconductor fabrication plants, the model demonstrates a 50% to 80% reduction in mean absolute error (MAE) compared to historical averages. Production results confirm a 2% to 3% increase in moves per productive hour and a 3% to 7% sustained increase in chamber utilization across a majority of the tools that we tested with. These results validate the strength of machine learning methods in enabling advanced parallel loading and just-in-time dispatching strategies.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"39 3","pages":"395-401"},"PeriodicalIF":2.5000,"publicationDate":"2026-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11574761/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/6/22 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Precise prediction of processing time (PT) and machine availability is critical for optimizing fabrication throughput. This paper presents a generalized, attention-based deep neural network designed to capture non-linear tool dynamics and high-dimensional categorical dependencies. Unlike rigid statistical baselines, our framework adapts to multiple prediction targets, including equipment-level process completion and granular chamber-level availability. Deployed in multiple GlobalFoundries semiconductor fabrication plants, the model demonstrates a 50% to 80% reduction in mean absolute error (MAE) compared to historical averages. Production results confirm a 2% to 3% increase in moves per productive hour and a 3% to 7% sustained increase in chamber utilization across a majority of the tools that we tested with. These results validate the strength of machine learning methods in enabling advanced parallel loading and just-in-time dispatching strategies.
基于注意力的深度学习用于大规模半导体晶圆厂工艺时间和工具可用性的多目标预测
精确预测加工时间(PT)和机器可用性是优化制造吞吐量的关键。本文提出了一个广义的,基于注意力的深度神经网络,旨在捕捉非线性工具动力学和高维分类依赖。与严格的统计基线不同,我们的框架适用于多个预测目标,包括设备级工艺完成度和颗粒级室可用性。在多个GlobalFoundries半导体制造工厂中,该模型显示,与历史平均水平相比,平均绝对误差(MAE)降低了50%至80%。生产结果证实,在我们测试的大多数工具中,每生产小时的移动次数增加了2%至3%,腔室利用率持续提高了3%至7%。这些结果验证了机器学习方法在实现高级并行加载和及时调度策略方面的优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信
小红书