Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices Using a Multiobjective Genetic Algorithm

IF 3.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wenguang Zhao;Gearóid Farrell;Rajesh Nimmagadda;Shailesh N. Joshi;Ercan. M. Dede;Tim Persoons
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Abstract

This article presents a robust multiobjective genetic algorithm (MOGA) optimization of the novel converging–diverging (CONDIV) manifold heatsink for external airflow environments. The CONDIV manifold is designed to protect internal heatsinks from debris-laden flows while maintaining high thermal performance. Previous studies relied on simple parametric sweeps for only a limited exploration of the design space of external manifolds, limiting the discovery of optimal designs. Here, a comprehensive MOGA framework is implemented, combining 3-D computational fluid dynamics (CFD) simulations validated against experiments. Seven geometric parameters are optimized to simultaneously minimize thermal resistance and pumping power, maximizing the coefficient of performance (COP). The design of experiments (DOE) is generated via Latin hypercube sampling (LHS), and a response surface model is constructed to approximate heatsink performance. The MOGA efficiently explores the design space, yielding a Pareto front of optimal solutions. Best compromise solutions (BCSs) are selected and verified through CFD. Results show that MOGA-optimized designs consistently outperform previous CONDIV and baseline plate-fin heatsinks, achieving up to 33% higher COP and 4.3% greater heat flux than previous CONDIV-H design and 42.4% higher mean COP than the baseline plate-fin heatsink. Detailed flow analyzes reveal that optimized BCSs improve airflow into internal channels and improve flow uniformity, resulting in superior thermal management. This demonstrates the strong potential of MOGA-driven optimization for advanced manifold heatsink applications in electrified transport.
基于多目标遗传算法的功率器件外部气流紧凑流形散热器优化
本文提出了一种鲁棒多目标遗传算法(MOGA)优化的新型收敛发散(CONDIV)流形散热器的外部气流环境。CONDIV歧管设计用于保护内部散热器免受碎屑流的影响,同时保持高热性能。以往的研究依赖于简单的参数扫描,仅对外部流形的设计空间进行了有限的探索,限制了最佳设计的发现。本文结合三维计算流体动力学(CFD)仿真和实验验证,实现了一个全面的MOGA框架。优化了七个几何参数,同时最小化热阻和泵送功率,最大化性能系数(COP)。通过拉丁超立方体采样(LHS)生成实验设计(DOE),并建立响应面模型来近似散热器性能。MOGA有效地探索了设计空间,产生了最优解决方案的帕累托前沿。最佳折衷方案(BCSs)是通过CFD选择和验证的。结果表明,moga优化设计始终优于以前的CONDIV和基准板翅片散热器,与以前的CONDIV- h设计相比,COP提高了33%,热通量提高了4.3%,平均COP比基准板翅片散热器高42.4%。详细的流动分析表明,优化后的bcs改善了进入内部通道的气流,提高了流动均匀性,从而实现了卓越的热管理。这证明了moga驱动的优化在电气化运输中先进的歧管散热器应用的强大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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