{"title":"A High Accuracy Lifetime Estimation Method for SiC MOSFETs Based on CNN-LSTM Networks","authors":"Xiaofeng Ding;Binbin Wang;Yanyong Yang;Mingbo Zhao;Kun Yang;Lyuzhang Peng","doi":"10.1109/TDMR.2026.3673635","DOIUrl":null,"url":null,"abstract":"Accurate lifetime prediction of power devices is critical for preventing unexpected converter failures and extending service life. However, existing methods often suffer from limited prediction accuracy, reliance on extensive experiments, and difficulties in practical implementation. This paper proposes a data-driven lifetime estimation method for silicon carbide (SiC) MOSFETs based on the prediction of a single aging precursor, i.e., the on-state drain-source voltage drop (<inline-formula> <tex-math>$V_{\\mathrm {ds\\_on}}$ </tex-math></inline-formula>). The proposed method integrates the local feature extraction capability of convolutional neural networks (CNNs) with the temporal modeling strength of long short-term memory (LSTM) networks, enabling effective capture of complex degradation trends and improved prediction accuracy. Moreover, it facilitates practical implementation, as <inline-formula> <tex-math>$V_{\\mathrm {ds\\_on}}$ </tex-math></inline-formula> is easy to measure online during normal operation. A DC power cycling test setup with online <inline-formula> <tex-math>$V_{\\mathrm {ds\\_on}}$ </tex-math></inline-formula> sampling is designed to accelerate device aging and collect degradation datasets. Multiple devices can be aged simultaneously under different operating conditions using the proposed setup, improving test efficiency. Experimental results under various aging conditions demonstrate that the proposed method achieves the highest prediction accuracy of 99.3%, outperforming the LSTM-based and exponential model-based approaches, which achieve average accuracies of 96.4% and 41.1%, respectively. These advancements are beneficial for enhancing system reliability and reducing operational costs in practical applications.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"26 2","pages":"531-540"},"PeriodicalIF":2.7000,"publicationDate":"2026-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11432920/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2026/3/12 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Accurate lifetime prediction of power devices is critical for preventing unexpected converter failures and extending service life. However, existing methods often suffer from limited prediction accuracy, reliance on extensive experiments, and difficulties in practical implementation. This paper proposes a data-driven lifetime estimation method for silicon carbide (SiC) MOSFETs based on the prediction of a single aging precursor, i.e., the on-state drain-source voltage drop ($V_{\mathrm {ds\_on}}$ ). The proposed method integrates the local feature extraction capability of convolutional neural networks (CNNs) with the temporal modeling strength of long short-term memory (LSTM) networks, enabling effective capture of complex degradation trends and improved prediction accuracy. Moreover, it facilitates practical implementation, as $V_{\mathrm {ds\_on}}$ is easy to measure online during normal operation. A DC power cycling test setup with online $V_{\mathrm {ds\_on}}$ sampling is designed to accelerate device aging and collect degradation datasets. Multiple devices can be aged simultaneously under different operating conditions using the proposed setup, improving test efficiency. Experimental results under various aging conditions demonstrate that the proposed method achieves the highest prediction accuracy of 99.3%, outperforming the LSTM-based and exponential model-based approaches, which achieve average accuracies of 96.4% and 41.1%, respectively. These advancements are beneficial for enhancing system reliability and reducing operational costs in practical applications.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.