Evaluating the Impact of Emerging Contaminants on Membrane Performance in Ultrapure-Water Production for Semiconductor Manufacturing: A PRISMA-Directed Meta-Analysis
IF 2.5 3区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0
Abstract
Ultrapure water (UPW) is indispensable in semiconductor manufacturing, where it serves as the foundational input for wafer cleaning, chemical dilution, and rinsing steps. As device geometries shrink below 5 nm, even parts-per-trillion (ppt) levels of contaminants can compromise yield, reliability, and compliance with industry standards such as SEMI F63 and ASTM D5127. Emerging contaminants (ECs) including per- and polyfluoroalkyl substances (PFAS), pharmaceuticals and personal care products (PPCPs), chemical mechanical planarization (CMP) organics, and micro/nanoplastics pose new challenges for membrane-based UPW treatment systems, especially under evolving regulations like the EPA PFAS Rule (2024). This PRISMA-guided meta-analysis evaluates 31 peer-reviewed studies (2002–2025) to quantify how reverse osmosis (RO), nanofiltration (NF), and ultrafiltration (UF) membranes perform under EC exposure. RO consistently achieved >99% rejection for long-chain PFAS and PPCPs but showed lower efficacy (93.8–99.2%) for short-chain compounds. NF demonstrated variable rejection (86–98%) depending on compound characteristics but offered energy savings in suitable contexts. UF was effective for microplastics but suffered significant flux decline (15–45%) with CMP-related organics. These findings offer critical, data-driven insights for semiconductor facilities seeking to maintain compliance, reduce operating costs, and optimize yield amid stricter water quality demands.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.