{"title":"Current Status of Bulk β-Ga₂O₃ and β-(AlxGa₁-ₓ)₂O₃ Crystal Growth","authors":"Zbigniew Galazka","doi":"10.1109/TSM.2025.3603605","DOIUrl":null,"url":null,"abstract":"<inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-Ga2O3 and its solid solutions <inline-formula> <tex-math>$\\beta $ </tex-math></inline-formula>-(AlxGa<inline-formula> <tex-math>${}_{\\text {1-x}}$ </tex-math></inline-formula>)2O3 are considered as potential candidate materials for next generation power devices due to their ultra-wide bandgaps (4.85–5.6 eV) and large breakdown electric field (<inline-formula> <tex-math>$\\geq 8$ </tex-math></inline-formula> MVcm<inline-formula> <tex-math>${}^{\\text {-1}}$ </tex-math></inline-formula>). Wafers prepared from bulk crystals constitute a foundation in a device fabrication chain. The present report briefly discusses thermodynamics, challenges in growing bulk crystals from the melt by different methods, which enable at least 2-inch diameter wafers, crystal structural quality, electrical properties, and factors affecting crystal growth costs.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 4","pages":"796-802"},"PeriodicalIF":2.5000,"publicationDate":"2025-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11143391","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11143391/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"2025/8/28 0:00:00","PubModel":"Epub","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
$\beta $ -Ga2O3 and its solid solutions $\beta $ -(AlxGa${}_{\text {1-x}}$ )2O3 are considered as potential candidate materials for next generation power devices due to their ultra-wide bandgaps (4.85–5.6 eV) and large breakdown electric field ($\geq 8$ MVcm${}^{\text {-1}}$ ). Wafers prepared from bulk crystals constitute a foundation in a device fabrication chain. The present report briefly discusses thermodynamics, challenges in growing bulk crystals from the melt by different methods, which enable at least 2-inch diameter wafers, crystal structural quality, electrical properties, and factors affecting crystal growth costs.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.