Dual-continuous graphene foam/poly(aryl ether ketone) composites with three-dimensional conductive networks for exceptional thermal conductivity and multifunctional performance

IF 9.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Materials Today Physics Pub Date : 2026-06-01 Epub Date: 2026-05-28 DOI:10.1016/j.mtphys.2026.102135
Xuesong Li, Haikun Zhu, Jingyi Kang, Jianxin Mu
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引用次数: 0

Abstract

Poly(aryl ether ketone) (PAEK)-based composites are highly desirable for thermal management in high-power electronic devices, yet their practical application is severely hindered by low intrinsic thermal conductivity and poor processability arising from high melt viscosity. Herein, we report a co-continuous composite architecture that simultaneously addresses these challenges by constructing a three-dimensional (3D) graphene foam (GF) skeleton via chemical vapor deposition using nickel foam as a template, followed by infusion of a fluorine-free phenolphthalein-based poly(aryl ether ketone) (EPEK-C) matrix pre-filled with multi-walled carbon nanotubes and graphene nanoplatelets (GnPs&MWCNTs). This unique design establishes a continuous and interconnected conductive network throughout the composite, effectively avoiding filler orientation-induced defects and minimizing interfacial thermal resistance. At a filler loading of 35.82 vol%, the resulting GF-GnPs&MWCNTs/EPEK-C composite exhibits outstanding in-plane and through-plane thermal conductivities of 19.9 W m−1 K−1 and 8.9 W m−1 K−1, respectively, representing enhancements of 7007% and 3078% compared to neat EPEK-C. Agari model analysis confirms the formation of a nearly ideal thermal percolating network, while Debye theory analysis reveals effective suppression of phonon scattering mechanisms. Benefiting from the highly conductive 3D graphene network, the composite also achieves an exceptional electrical conductivity of 1.68 × 104 S m−1 and an electromagnetic interference shielding effectiveness of 51.8 dB. Power coefficient analysis reveals that reflection dominates the shielding mechanism, attributed to the three-dimensional conductive network that provides multiple reflective surfaces and induces multiple internal reflections. The specific shielding effectiveness (SSE/t) reaches 6996 dB cm2/g. Furthermore, the material demonstrates rapid and stable Joule heating (∼1600 s) and efficient photothermal conversion (efficiency∼50.99%). This work presents a high-performance multifunctional composite for integrated thermal management and electromagnetic protection, offering a promising pathway for the development of next-generation multifunctional materials.
双连续石墨烯泡沫/聚芳醚酮复合材料具有优异的导热性和多功能性能的三维导电网络
聚芳醚酮(PAEK)基复合材料是高功率电子器件热管理的理想材料,但其实际应用受到固有导热系数低和高熔体粘度导致的加工性差的严重阻碍。在此,我们报告了一种共连续复合材料结构,通过化学气相沉积以泡沫镍为模板构建三维(3D)泡沫石墨烯(GF)骨架,然后注入无氟酚醛基聚芳醚酮(EPEK-C)基质,预填充多壁碳纳米管和石墨烯纳米片(GnPs&MWCNTs),同时解决了这些挑战。这种独特的设计在整个复合材料中建立了一个连续的、相互连接的导电网络,有效地避免了填料取向引起的缺陷,并最大限度地减少了界面热阻。在填充量为35.82 vol%时,GF-GnPs&;MWCNTs/EPEK-C复合材料的面内导热系数和通面导热系数分别为19.9 W m−1 K−1和8.9 W m−1 K−1,与纯EPEK-C相比分别提高了7007%和3078%。Agari模型分析证实了近似理想的热渗透网络的形成,Debye理论分析揭示了声子散射的有效抑制机制。得益于高导电性的3D石墨烯网络,该复合材料还实现了1.68 × 104 S m−1的卓越导电性和51.8 dB的电磁干扰屏蔽效率。功率系数分析表明,反射在屏蔽机制中占主导地位,这是由于三维导电网络提供了多个反射面并诱导了多个内部反射。比屏蔽效能(SSE/t)达到6996 dB cm2/g。此外,该材料具有快速稳定的焦耳加热(~ 1600 s)和高效的光热转换(效率~ 50.99%)。本研究提出了一种集热管理和电磁保护于一体的高性能多功能复合材料,为下一代多功能材料的发展提供了一条有希望的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Materials Today Physics
Materials Today Physics Materials Science-General Materials Science
CiteScore
14.00
自引率
7.80%
发文量
284
审稿时长
15 days
期刊介绍: Materials Today Physics is a multi-disciplinary journal focused on the physics of materials, encompassing both the physical properties and materials synthesis. Operating at the interface of physics and materials science, this journal covers one of the largest and most dynamic fields within physical science. The forefront research in materials physics is driving advancements in new materials, uncovering new physics, and fostering novel applications at an unprecedented pace.
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