Two-Dimensional Simulation of the Discharge Characteristics of He Atmospheric Pressure Plasma Jet Array

IF 3.5 3区 物理与天体物理 Q3 ENGINEERING, CHEMICAL
Lijun Wang, Junxian Liu, Qinghua Shi, Zhongji Han, Huan Zhao
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引用次数: 0

Abstract

In this paper, 2D model of APPJ array is established to investigate the interaction between jets in He APPJ array and plasma parameter distribution. The effects of gas flow rate, ignition voltage amplitude, and number of dielectric tubes on discharge characteristics were simultaneously investigated. Simulation results indicate that within the mixing zone, the combined effects of gas flow distribution and spatial electric fields cause lateral jets to deflect toward central jet. The intensity and propagation velocity of jets exhibit a distribution pattern where outer regions are higher while inner regions are lower. The ionization mechanisms of side and central jet differ, resulting in higher electron temperatures and charge densities at outer edges and heads, while central jet forms ring-shaped structure.

Abstract Image

He常压等离子体射流阵列放电特性的二维模拟
本文建立了APPJ阵列的二维模型,研究了He APPJ阵列中射流与等离子体参数分布之间的相互作用。同时研究了气体流量、点火电压幅值和介质管数对放电特性的影响。模拟结果表明,在混合区内,气流分布和空间电场的共同作用使侧向射流向中心射流偏转。射流的强度和传播速度呈现出外区高、内区低的分布规律。侧喷流和中心喷流的电离机制不同,导致其外围和头部的电子温度和电荷密度较高,而中心喷流则形成环状结构。
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来源期刊
Plasma Chemistry and Plasma Processing
Plasma Chemistry and Plasma Processing 工程技术-工程:化工
CiteScore
5.90
自引率
8.30%
发文量
73
审稿时长
6-12 weeks
期刊介绍: Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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