Extrapolation of the degradation on FinFET FPGA: Comparison between 20,000 h of measurement and model

IF 1.9 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2026-04-01 Epub Date: 2026-02-11 DOI:10.1016/j.microrel.2026.116048

J. Sobas , F. Marc

引用次数: 0

Abstract

Most of the time, ageing model for digital circuit are based on short time and high stress measurements. Then, ageing is extrapolated in time and for operational condition of use. Does the model correctly predict ageing after several years of use under normal temperature and voltage conditions? This paper presents ageing and measurements of degradation made during more than 20,000 h on an optimized test bench on nine FPGA including 567 ring oscillators each, with different temperature and voltage stresses. In our knowledge, this is the longer ageing test performed on digital circuit. Based on these measures, we compare semi-empirical modelling made with high temperature stresses and short ageing time (1000 h) with low temperature stresses and long ageing time (20,000 h).

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FinFET FPGA退化的外推：20,000 h测量与模型的比较

大多数情况下，数字电路的老化模型是基于短时间和高应力的测量。然后，根据使用的操作条件及时推断老化。在正常温度和电压条件下使用几年后，模型是否正确预测老化？本文介绍了在一个优化的试验台上，在不同的温度和电压应力下，在9个FPGA（每个FPGA包括567个环形振荡器）上进行了超过20,000小时的老化和退化测量。据我们所知，这是在数字电路上进行的较长的老化测试。基于这些措施，我们比较了高温应力和短时效时间（1000 h）与低温应力和长时效时间（20,000 h）的半经验模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.