A 200 GHz Wideband and Low-Power Direct-Downconversion Receiver Element in 16 nm FinFET Technology

IF 2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Ethan Chou;Hesham Beshary;Nima Baniasadi;Ali M. Niknejad
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引用次数: 0

Abstract

This letter presents a wideband and low-power direct-downconversion 200 GHz receiver element for digital-beamforming applications implemented in 16 nm FinFET technology. Wideband and low integrated receiver noise figure of 9.8 dB across a 21 GHz baseband bandwidth is realized with a differential low-noise amplifier leveraging an active input balun stage, while wideband gain of 29 dB with a 3-dB bandwidth at RF of 42 GHz is maintained throughout the receiver chain. Low-loss I/Q splitting and current-efficient variable-gain baseband amplification enable relatively low total DC power consumption of 130 mW, including the LO chain. The high instantaneous bandwidth and low power consumption enable potentially high data rates with high energy efficiency.
一种用于16nm FinFET技术的200ghz宽带低功耗直接下变频接收器元件
本文介绍了一种宽带低功耗直接下变频200ghz接收器元件,用于采用16nm FinFET技术实现的数字波束成形应用。通过利用有源输入平衡级的差分低噪声放大器,在21 GHz基带带宽上实现了9.8 dB的宽带和低集成接收器噪声系数,同时在整个接收器链中保持了29 dB的宽带增益和42 GHz射频下的3 dB带宽。低损耗I/Q分割和电流效率可变增益基带放大使包括LO链在内的直流总功耗相对较低,为130 mW。高瞬时带宽和低功耗使潜在的高数据速率与高能效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Solid-State Circuits Letters
IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering
CiteScore
4.30
自引率
3.70%
发文量
52
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