A 37.8 Mb/mm² SRAM in Intel 18A Technology Featuring a Resistive Supply-Line Write Scheme and Write-Assist With Parallel Boost Injection

IF 2 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Harold Pilo;Manish Arora;Chien-An Lai;Mike Lee;Zack Lo;Mayur Randeria
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引用次数: 0

Abstract

A high-density (HD), SRAM-based register file (RF) has been demonstrated in Intel 18A Technology (Wang et al., 2025 and Pilo et al., 2025) featuring RibbonFET GAA transistors and a back side power delivery network (BSDPN). The RF is optimized for HD and array efficiency and achieves a density of 37.8 Mb/mm2, the highest density reported to date for an RF in the most advanced technology nodes (Wang et al., 2025, Chang et al., 2025, and Pilo et al., 2025). It is implemented with a conventional bitline (BL), two-bank memory architecture and it can be used as the SRAM workhorse for most SoC applications with maximum bit-count of 262Kb.
采用英特尔18A技术的37.8 Mb/mm²SRAM,具有电阻供电线路写入方案和并行升压注入的写入辅助
在Intel 18A Technology (Wang et al., 2025 and Pilo et al., 2025)中已经演示了一种高密度(HD)、基于sram的寄存器文件(RF),该文件具有带状场效应晶体管GAA晶体管和背面供电网络(BSDPN)。该射频针对高清和阵列效率进行了优化,密度达到37.8 Mb/mm2,这是迄今为止报道的最先进技术节点射频的最高密度(Wang et al., 2025; Chang et al., 2025; Pilo et al., 2025)。它采用传统的位线(BL)、双银行存储器架构,可以作为SRAM的主力,用于大多数SoC应用,最大比特数为262Kb。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Solid-State Circuits Letters
IEEE Solid-State Circuits Letters Engineering-Electrical and Electronic Engineering
CiteScore
4.30
自引率
3.70%
发文量
52
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