Temperature- and Bias-Dependent Capture–Emission Time Maps in Electrolyte-Gated Graphene Field-Effect Transistors

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Adriana Oliveira;Henrique Nóbrega;Telma Domingues;Jérôme Borme;Pedro Alpuim;João Mouro
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Abstract

In this work, we have experimentally studied the response of electrolyte-gated graphene field-effect transistors (EG-gFETs) under various stress and relaxation conditions at different voltage bias values and temperatures. We fit all the experimental data with an analytical model based on charge trapping at the silicon oxide substrate defects in contact with the graphene channel. In the model, the electron transitions require overcoming an energetic barrier leading to the new state and, consequently, the process is temperature- and gate-bias-dependent. The fit parameters to the experimental data are then used for the first time to construct the capture–emission time maps (CET maps) of the EG-gFET devices, or the capture/emission time distribution of the oxide defects and their contribution to the device’s drift and noise at each timescale. Studying these maps as a function of the bias and temperature allows us to gain insight into the best experimental conditions to minimize electrical noise during measurements, to propose improved protocols when using EG-gFETs in applications and to guide circuit designers on deciding the best operating conditions.
电解质门控石墨烯场效应晶体管的温度和偏置相关捕获-发射时间图
在这项工作中,我们实验研究了电解质门控石墨烯场效应晶体管(eg - gfet)在不同电压偏置值和温度下的各种应力和弛豫条件下的响应。我们将所有实验数据与基于电荷捕获的分析模型拟合在石墨烯通道接触的氧化硅衬底缺陷处。在模型中,电子跃迁需要克服导致新状态的能量障碍,因此,该过程依赖于温度和栅极偏置。然后,将实验数据的拟合参数首次用于构建EG-gFET器件的捕获-发射时间图(CET图),或氧化物缺陷的捕获/发射时间分布及其在每个时间尺度下对器件漂移和噪声的贡献。研究这些图作为偏置和温度的函数,使我们能够深入了解最佳实验条件,以最大限度地减少测量过程中的电气噪声,在应用中使用eg - gfet时提出改进的协议,并指导电路设计人员决定最佳操作条件。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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