Key components for unified 3D wireless communication networks

IF 2.6 4区计算机科学 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

Microprocessors and Microsystems Pub Date : 2025-12-01 Epub Date: 2025-09-15 DOI:10.1016/j.micpro.2025.105204

Marko Andjelkovic , Nebojsa Maletic , Nicola Miglioranza , Milos Krstic , Enrico Koeck , Jan Buchholz , Maike Taddiken , Markus Fehrenz , Shaden Baradie , Dirk Wübben , Markus Breitbach

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引用次数: 0

Abstract

The integration of conventional terrestrial wireless communication networks and non-terrestrial networks (NTNs) is the main prerequisite for achieving global connectivity in the next generation (6G) wireless communications. Such integrated communication networks are usually referred to as the unified 3D networks. These networks need to meet the requirements for 6G communications in terms of higher data rates, as well as enhanced reliability, security and network reconfigurability. To achieve these goals, new technologies and components have to be developed. This work introduces the German project 6G-TakeOff, aimed at the development of innovative solutions for unified 3D networks. The project consortium brings together leading academic and industrial partners, covering the entire value chain from design of electronics to applications. In this work, the focus is on the development of key hardware components to support the wireless communication in 3D unified networks. The design concept for each component and the planned demonstrators are presented.

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统一三维无线通信网络的关键部件

传统地面无线通信网络与非地面无线通信网络（ntn）的融合是实现下一代（6G）无线通信全球互联互通的主要前提。这种集成通信网络通常被称为统一三维网络。这些网络需要在更高的数据速率方面满足6G通信的要求，以及增强的可靠性、安全性和网络可重构性。为了实现这些目标，必须开发新的技术和组件。这项工作介绍了德国6g -起飞项目，旨在为统一3D网络开发创新解决方案。该项目联盟汇集了领先的学术和工业合作伙伴，涵盖了从电子设计到应用的整个价值链。在本工作中，重点研究了支持三维统一网络无线通信的关键硬件组件的开发。介绍了每个组件的设计概念和计划的演示。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microprocessors and Microsystems 工程技术-工程：电子与电气

CiteScore

6.90

自引率

3.80%

发文量

204

审稿时长

172 days

期刊介绍： Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC). Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systems are also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.