3D-IC Chiplet Integrated Power Supply With LDO, SCVR, and Buck DC–DC Converter

Abstract

With the rapid advancement of chiplet and heterogenous integration technologies, delivering power through the package, redistribution layer (RDL), and chip layers in 3-D space has become a fundamental challenge for high-performance SoCs. This letter provides a comprehensive overview of power delivery solutions, including low-dropout regulator (LDOs), switched capacitor converters, and Buck converters. It further details and compares advanced techniques such as novel conversion topologies, control schemes, optimization strategies, and integration strategies, offering insights into overcoming the power wall in emerging 3D-ICs.