Statistical Investigation of Al$_{2}$O$_{3}$ Insertion Layer on the Endurance of Hf$_{0.5}$Zr$_{0.5}$O$_{2}$ Films: Abrupt Endurance Degradation and Mechanism
IF 2.5 4区 工程技术Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
{"title":"Statistical Investigation of Al$_{2}$O$_{3}$ Insertion Layer on the Endurance of Hf$_{0.5}$Zr$_{0.5}$O$_{2}$ Films: Abrupt Endurance Degradation and Mechanism","authors":"Heng Ye;Xiaomin Lai;Xinzhong Zhu;Jing Liu;Xiaoshan Pan;Yuanlu Xie;Lanlong Ji;Kai Xi;Tiancheng Gong;Yuan Qiu","doi":"10.1109/TNANO.2025.3611601","DOIUrl":null,"url":null,"abstract":"In this work, the effect of ultrathin Al<inline-formula><tex-math>$_{\\bm {2}}$</tex-math></inline-formula>O<inline-formula><tex-math>$_{\\bm {3}}$</tex-math></inline-formula> insertion layer on the endurance characteristics of Hf<inline-formula><tex-math>$_{\\bm {0.5}}$</tex-math></inline-formula>Zr<inline-formula><tex-math>$_{\\bm {0.5}}$</tex-math></inline-formula>O<inline-formula><tex-math>$_{\\bm {2}}$</tex-math></inline-formula> (HZO) layer is statistically investigated. It was found that the ultrathin Al<inline-formula><tex-math>$_{\\bm {2}}$</tex-math></inline-formula>O<inline-formula><tex-math>$_{\\bm {3}}$</tex-math></inline-formula> insertion layer will not improve or reduce the endurance of HZO devices within the low operation voltage range. However, an abrupt endurance degradation phenomenon is observed when increasing the operation voltage to a specific value and the endurance of HZO/Al<inline-formula><tex-math>$_{\\bm {2}}$</tex-math></inline-formula>O<inline-formula><tex-math>$_{\\bm {3}}$</tex-math></inline-formula> layer is sharply lower than HZO device. This phenomenon is finally explained by the leakage-current-assist polarization switching mechanism after quantitatively extracting the continuous charge density during the polarization switching by pulse measurement. The findings of this work provide a deep understanding of the endurance failure mechanism of Ferroelectric/Dielectric (FE/DE) devices and are helpful for the reliability investigation of the gate stack in Fe-FET.","PeriodicalId":449,"journal":{"name":"IEEE Transactions on Nanotechnology","volume":"24 ","pages":"500-503"},"PeriodicalIF":2.5000,"publicationDate":"2025-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Nanotechnology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11172349/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, the effect of ultrathin Al$_{\bm {2}}$O$_{\bm {3}}$ insertion layer on the endurance characteristics of Hf$_{\bm {0.5}}$Zr$_{\bm {0.5}}$O$_{\bm {2}}$ (HZO) layer is statistically investigated. It was found that the ultrathin Al$_{\bm {2}}$O$_{\bm {3}}$ insertion layer will not improve or reduce the endurance of HZO devices within the low operation voltage range. However, an abrupt endurance degradation phenomenon is observed when increasing the operation voltage to a specific value and the endurance of HZO/Al$_{\bm {2}}$O$_{\bm {3}}$ layer is sharply lower than HZO device. This phenomenon is finally explained by the leakage-current-assist polarization switching mechanism after quantitatively extracting the continuous charge density during the polarization switching by pulse measurement. The findings of this work provide a deep understanding of the endurance failure mechanism of Ferroelectric/Dielectric (FE/DE) devices and are helpful for the reliability investigation of the gate stack in Fe-FET.
期刊介绍:
The IEEE Transactions on Nanotechnology is devoted to the publication of manuscripts of archival value in the general area of nanotechnology, which is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.