{"title":"A RISC-V SoC With Reconfigurable Custom Instructions on a Synthesized eFPGA Fabric in 22nm FinFET","authors":"Prashanth Mohan;Siddharth Das;Ken Mai","doi":"10.1109/LSSC.2025.3618942","DOIUrl":null,"url":null,"abstract":"This letter presents a flexible and energy-efficient RISC-V system-on-chip (SoC) in 22nm FinFET technology, achieving state-of-the-art performance by tightly integrating the CPU with a synthesized embedded FPGA (embedded field programmable gate array (eFPGA)), enabling the implementation of reconfigurable custom instructions. The tight integration of the eFPGA with SoC scratchpad memory facilitates parallel high-bandwidth (16 GB/s) access to scratchpad SRAMs and enables rapid eFPGA reconfiguration (<inline-formula> <tex-math>$2~\\mu $ </tex-math></inline-formula>s) to switch between custom instruction sets. The eFPGA fabric itself is optimized for compute-intensive tasks, featuring fused logic tiles that amortize routing overheads to achieve a compute density of 22.3 GOPS/mm2. The measurement results from the fabricated chip demonstrate a peak energy efficiency of 748 GOPS/W (INT8) while improving throughput and energy by 1-2 orders of magnitude compared to the CPU for accelerated applications.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"8 ","pages":"321-324"},"PeriodicalIF":2.0000,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/11195177/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
This letter presents a flexible and energy-efficient RISC-V system-on-chip (SoC) in 22nm FinFET technology, achieving state-of-the-art performance by tightly integrating the CPU with a synthesized embedded FPGA (embedded field programmable gate array (eFPGA)), enabling the implementation of reconfigurable custom instructions. The tight integration of the eFPGA with SoC scratchpad memory facilitates parallel high-bandwidth (16 GB/s) access to scratchpad SRAMs and enables rapid eFPGA reconfiguration ($2~\mu $ s) to switch between custom instruction sets. The eFPGA fabric itself is optimized for compute-intensive tasks, featuring fused logic tiles that amortize routing overheads to achieve a compute density of 22.3 GOPS/mm2. The measurement results from the fabricated chip demonstrate a peak energy efficiency of 748 GOPS/W (INT8) while improving throughput and energy by 1-2 orders of magnitude compared to the CPU for accelerated applications.