An interface trap density evaluation method for SiC MOSFET based on neural network

IF 1.9 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Microelectronics Reliability Pub Date : 2025-12-01 Epub Date: 2025-10-14 DOI:10.1016/j.microrel.2025.115934
Borui Yang , Guicui Fu , Bo Wan , Xiangfen Wang
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引用次数: 0

Abstract

The high density of interface defects at the gate oxide interface is closely related to the device characteristics and reliability of silicon carbide metal-oxide-semiconductor field effect transistors. However, an efficient and reliable characterization method for interface defects remains to be developed. In this work, we propose a neural network method for evaluating the interface trap density distribution and fixed oxide charge density using the transfer characteristics of devices. The neural network utilizes a long short-term memory structure to capture the mapping relationship between the transfer characteristic and the interface defect parameters. The numerical simulation data are used to form the training dataset of the network, and an effective preprocessing method is also presented. The proposed method was successfully verified by comparing simulated transfer characteristics using the evaluated results of commercial devices with corresponding measurements. Also, the interface defect parameters were evaluated by the subthreshold current method for comparison. The result shows that the evaluated results of the proposed method are close to the experimental evaluated results, with relative errors of 3.3 %, 6.6 %, and 28.2 % for the three devices under threshold voltage, respectively. Further, the proposed method was successfully applied during the high temperature gate bias tests to detect the degradation trend of the gate oxide interface. The result reflects its practicality for the interface reliability analysis of silicon carbide metal-oxide-semiconductor field effect transistors.
基于神经网络的SiC MOSFET界面阱密度评价方法
栅极氧化界面处的高密度界面缺陷与碳化硅金属氧化物半导体场效应晶体管的器件特性和可靠性密切相关。然而,一种高效可靠的界面缺陷表征方法仍有待开发。在这项工作中,我们提出了一种神经网络方法,利用器件的转移特性来评估界面陷阱密度分布和固定氧化物电荷密度。神经网络利用长短期记忆结构捕捉传递特性与界面缺陷参数之间的映射关系。利用数值模拟数据形成网络训练数据集,并提出了一种有效的预处理方法。通过将商业装置的模拟传输特性与相应的测量结果进行比较,成功地验证了所提出的方法。同时,采用亚阈值电流法对界面缺陷参数进行评估,进行比较。结果表明,该方法的评估结果与实验评估结果接近,三种器件在阈值电压下的相对误差分别为3.3%、6.6%和28.2%。此外,该方法还成功地应用于栅极氧化界面的高温偏置测试中,用于检测栅极氧化界面的降解趋势。结果表明,该方法对碳化硅金属氧化物半导体场效应晶体管界面可靠性分析具有实用性。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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