Yunzhou Liu , Shihan Xu , Kang Zhang , Hualong Wu , Qiao Wang , Qianguang Liao , Dan Lin , Ping Xu , Jinhua Hu , Pinghuan Zhuo , Yelin Li , Chenguang He
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引用次数: 0
Abstract
AlGaN/GaN heterostructures are cornerstone materials for high-performance devices like High Electron Mobility Transistors (HEMTs), yet their fabrication remains largely empirical. A critical bottleneck is the lack of atomic-scale theoretical frameworks to clarify how deposition parameters tune key heterostructure properties—dislocation density, structural composition, surface roughness, in-plane stress—hindering the rational optimization of device quality. To fill this gap, we present a molecular dynamics (MD)-based atomic-scale investigation of AlGaN deposition on GaN templates, aiming to uncover the unelucidated mechanisms that quantify the correlative trends between such parameters and properties at the atomic level. Key findings include three fabrication-relevant insights: 1) For temperatures (1200–1800 K), we identified 1600 K as the optimal value, featuring peak crystalline quality and monotonic roughness reduction—driven by enhanced adatom mobility. Our work clarifies this mobility's synchronous regulation of the two key properties in systems like AlGaN/GaN heterostructures, offering new atomic-scale insights into their correlation. 2) For Al/Ga flux ratios (1:4 to 3:1), Al/Ga = 1:3 yields highest crystallinity; Al/Ga ≥1 surfaces are smoother than Al/Ga <1. This divergence comes from clarified atomic process: Ga-rich conditions promote Ga desorption, while higher Al suppresses it—unhighlighted before. 3) We confirmed that in-plane tensile stress (arising from lattice mismatch) is dominant; further, our molecular dynamics (MD) simulations uniquely quantify how temperature and flux modulate the stress magnitude at the atomic interface. This work's innovation is translating atomic deposition dynamics into actionable AlGaN/GaN guidelines—addressing trial-and-error/theory disconnect. Findings guide parameter optimization, accelerating high-quality heterostructure synthesis for next-generation HEMTs.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.