{"title":"Interfacial Interaction and Stress Engineering for Enhancing Electrical Conductivity of Graphene/Copper Composites","authors":"Zhihao Zheng, Wentao Yuan, Yiling Huang, Yifeng Zhao, Jiayao Chen, Xuefu Zhang, Yi Zeng, Zhiyuan Shi, Qingkai Yu, Xiaoming Xie","doi":"10.1016/j.mtphys.2025.101895","DOIUrl":null,"url":null,"abstract":"Copper with electrical conductivity (EC) exceeding 100% International Annealed Copper Standard (IACS) is in high demand for power and microelectronic applications. Graphene/copper composites have emerged as a promising solution to meet this demand. However, the mechanism underlying the EC enhancement remains a subject of debate, which poses a challenge to their scalable production. In this study, we fabricated graphene/copper composite through plasma-enhanced chemical vapor deposition (PECVD) and demonstrated the enhanced EC up to 109.4% IACS by controlling the interfacial interaction between graphene and copper. Electron backscatter diffraction (EBSD) reveals directional residual stresses in the copper substrate, while high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA) resolve a near-surface lattice-distortion layer beneath a few layers continuous graphene. By tuning hydrogenation defects through RF power, we modulate interfacial adhesion, the induced stress state, and the EC enhancement. The results establish interfacial-stress engineering as a practical route to copper conductors surpassing 100% IACS.","PeriodicalId":18253,"journal":{"name":"Materials Today Physics","volume":"20 1","pages":""},"PeriodicalIF":9.7000,"publicationDate":"2025-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Today Physics","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.mtphys.2025.101895","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Copper with electrical conductivity (EC) exceeding 100% International Annealed Copper Standard (IACS) is in high demand for power and microelectronic applications. Graphene/copper composites have emerged as a promising solution to meet this demand. However, the mechanism underlying the EC enhancement remains a subject of debate, which poses a challenge to their scalable production. In this study, we fabricated graphene/copper composite through plasma-enhanced chemical vapor deposition (PECVD) and demonstrated the enhanced EC up to 109.4% IACS by controlling the interfacial interaction between graphene and copper. Electron backscatter diffraction (EBSD) reveals directional residual stresses in the copper substrate, while high-resolution transmission electron microscopy (HRTEM) and geometric phase analysis (GPA) resolve a near-surface lattice-distortion layer beneath a few layers continuous graphene. By tuning hydrogenation defects through RF power, we modulate interfacial adhesion, the induced stress state, and the EC enhancement. The results establish interfacial-stress engineering as a practical route to copper conductors surpassing 100% IACS.
期刊介绍:
Materials Today Physics is a multi-disciplinary journal focused on the physics of materials, encompassing both the physical properties and materials synthesis. Operating at the interface of physics and materials science, this journal covers one of the largest and most dynamic fields within physical science. The forefront research in materials physics is driving advancements in new materials, uncovering new physics, and fostering novel applications at an unprecedented pace.