Optimal stoichiometry and performance evolution in As-Se based OTS devices

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuhao Wang , Haotian Wang , Xiangyu Fu , Yulai Zhu , Sannian Song , Zhitang Song
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Abstract

Arsenic-selenium (As-Se)-based ovonic threshold switching (OTS) devices are essential components for facilitating effective non-volatile memory systems. This study examines the performance evolution of As-Se OTS devices with different arsenic concentrations. A non-monotonic pattern is evident in device performance: the leakage current initially diminishes and subsequently escalates with rising As content, whereas the threshold voltage displays an inverse tendency. The gadget containing 50 % As exhibits reduced leakage and enhanced durability features. Molecular dynamics simulations indicate that at low arsenic level, Se-Se homopolar bonds are predominant; however, these bonds are markedly diminished at intermediate compositions. At elevated arsenic concentrations, arsenic-selenium heteropolar bonds diminish, but arsenic-arsenic interactions prevail. Analysis of the coordination number reveals that the average coordination number, at 50 % arsenic, nearly attains the optimal threshold of 2.4, signifying enhanced network stiffness. Furthermore, electronic structure study indicates that the bandgap reaches its peak at a 50 % composition, reflecting substantial contributions from both As and Se p-orbitals. These findings determine the ideal As-Se stoichiometry for high-performance OTS devices and provide significant insights for material and device design.
As-Se基OTS器件的最佳化学计量学和性能演化
基于砷硒(As-Se)的卵形阈值开关(OTS)器件是促进有效的非易失性存储系统的重要组成部分。本研究考察了不同砷浓度下As-Se OTS器件的性能演变。器件性能表现出明显的非单调模式:泄漏电流最初减小,随后随着As含量的增加而升高,而阈值电压则呈现相反的趋势。含有50%砷的小装置具有减少泄漏和增强耐用性的特点。分子动力学模拟表明,在低砷水平下,Se-Se均极键占主导地位;然而,这些键在中间组合物中明显减少。在砷浓度升高时,砷-硒异极性键减弱,但砷-砷相互作用占上风。配位数分析表明,当砷含量为50%时,平均配位数接近最佳阈值2.4,表明网络刚度增强。此外,电子结构研究表明,在50%的成分时,带隙达到峰值,反映了As和Se p轨道的大量贡献。这些发现确定了高性能OTS器件的理想As-Se化学计量,并为材料和器件设计提供了重要见解。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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