{"title":"A Battery-Free BLE Backscatter Communication Chip for Wearable Systems","authors":"Yongling Zhang;Ji Xiong;Junzai Chen;Xiaoyu Li;Jinrui Zuo;Yan Wang;Xiaoyi Wang;Miao Meng","doi":"10.1109/LSSC.2025.3612423","DOIUrl":null,"url":null,"abstract":"This letter presents a backscatter chip that features bidirectional communication with commodity bluetooth low-energy (BLE) transceivers. For uplink, the chip reflects a reverse-whitened BLE tone into single-sideband (SSB) GFSK-modulated BLE packets via a proposed replica VCO-based GFSK modulator and an inductor-free SSB reflector. For downlink, the BLE packets are frequency down-converted passively by utilizing a reverse-whitened BLE tone followed by a proposed self-calibrated GFSK demodulator to recover the downlink data at ultralow power with improved robustness. A dual-linearly polarized microstrip patch antenna (DPMPA) is integrated to enable concurrent RF energy harvesting and communication in a wearable form factor. Implemented in 65-nm CMOS, the chip consumes <inline-formula> <tex-math>$1.4~\\mu $ </tex-math></inline-formula>W for downlink and <inline-formula> <tex-math>$15.8~\\mu $ </tex-math></inline-formula>W for uplink. Wireless tests demonstrated a 50 cm downlink and >3 m uplink ranges at 20 dBm EIRP.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"8 ","pages":"297-300"},"PeriodicalIF":2.0000,"publicationDate":"2025-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/11174967/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
This letter presents a backscatter chip that features bidirectional communication with commodity bluetooth low-energy (BLE) transceivers. For uplink, the chip reflects a reverse-whitened BLE tone into single-sideband (SSB) GFSK-modulated BLE packets via a proposed replica VCO-based GFSK modulator and an inductor-free SSB reflector. For downlink, the BLE packets are frequency down-converted passively by utilizing a reverse-whitened BLE tone followed by a proposed self-calibrated GFSK demodulator to recover the downlink data at ultralow power with improved robustness. A dual-linearly polarized microstrip patch antenna (DPMPA) is integrated to enable concurrent RF energy harvesting and communication in a wearable form factor. Implemented in 65-nm CMOS, the chip consumes $1.4~\mu $ W for downlink and $15.8~\mu $ W for uplink. Wireless tests demonstrated a 50 cm downlink and >3 m uplink ranges at 20 dBm EIRP.