Wenlong Liu , Chuangqi Zhang , Di Li , Jin Zong , Jiahua Wei , Guoqiang Tan , Qibin Yuan , Ao Xia , Fulai Qi , Xu Xue
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引用次数: 0
Abstract
The development of Resistive Random Access Memory (RRAM) devices is expected to drive a revolutionary change in artificial intelligence, especially playing a key role in neuromorphic computing applications. Novel RRAM devices with self-rectifying and analog characteristics have become a research hotspot in current research areas due to their unique electrical characteristics. Here, a remarkable bipolar resistive switching (RS) behavior with the self-rectifying effects and analog characteristics is observed in the (16-x)Bi0.95Er0.05FeO3/(x)ZnFe2O4 (BEFO/ZFO; x = 1, 3, 5, 7) heterostructures, which are prepared on FTO substrates using the sol-gel method. The optimal RS behavior is obtained for the x = 3 sample, including endurance over 1000 operations and stable retention up to 5000 s. The conductive mechanisms of the x = 3 devices at high resistance state (HRS) complies with the Space Charge Limited Current (SCLC) model. In contrast, the low resistance state (LRS) is dominated by the Schottky model. The RS behavior is correlated with the changes in the depletion layer width and barrier height at the p-n junction interface. Moreover, the conductivity of the x = 3 sample increases with successive sweeps of the applied voltage, showing favorable analog characteristics, suggesting the (16-x)BEFO/(x)ZFO heterostructures with the self-rectifying effect offer promising prospects for the RRAM devices in realizing neuromorphic applications.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.