Scalable fabrication of CuOx/NiOx composite hole transport layer via a sequential magnetron sputtering method for efficient and stable perovskite solar cells
IF 4.6 3区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yinsheng Gu , Yongpan Liu , Yuchen Sheng , Fang Wang , Yang Yang , Chang Liu , Jiwen Jiang , Kuanxiang Zhang , Yingwei Lu , Paifeng Luo
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引用次数: 0
Abstract
Magnetron sputtering inorganic NiOx hole transport layer (HTL) has become a practical method in the industrial production of perovskite solar cells (PSCs), owing to its advantages of large-area fabrication and high process controllability. However, the relatively poor conductivity and high defect density of HTL hinder further improvements in device performance. In this work, to address the above issues of sputtered NiOx, the composite HTL of CuOx/NiOx was innovatively deposited by sequential sputtering of Cu and NiO targets with the easy industrial production. Subsequently, through the optimization of the sputtering process parameters (time, atmosphere, and annealing temperature), the composite HTL demonstrated superior photoelectric performance compared to the single NiOx. Meanwhile, the introduction of CuOx effectively reduced the defect density of the PSCs, thereby improving the carrier transport dynamics. Finally, this viable industrialization strategy boosted the PCE of MA0.85FA0.15PbI3 PSCs from 15.3 % to 17.86 %, which was prepared without spin-coating fragile self-assembled monolayers (SAMs) under open-air conditions, demonstrating promising potential for commercial applications.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
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Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.