Scalable fabrication of CuOx/NiOx composite hole transport layer via a sequential magnetron sputtering method for efficient and stable perovskite solar cells

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yinsheng Gu , Yongpan Liu , Yuchen Sheng , Fang Wang , Yang Yang , Chang Liu , Jiwen Jiang , Kuanxiang Zhang , Yingwei Lu , Paifeng Luo
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引用次数: 0

Abstract

Magnetron sputtering inorganic NiOx hole transport layer (HTL) has become a practical method in the industrial production of perovskite solar cells (PSCs), owing to its advantages of large-area fabrication and high process controllability. However, the relatively poor conductivity and high defect density of HTL hinder further improvements in device performance. In this work, to address the above issues of sputtered NiOx, the composite HTL of CuOx/NiOx was innovatively deposited by sequential sputtering of Cu and NiO targets with the easy industrial production. Subsequently, through the optimization of the sputtering process parameters (time, atmosphere, and annealing temperature), the composite HTL demonstrated superior photoelectric performance compared to the single NiOx. Meanwhile, the introduction of CuOx effectively reduced the defect density of the PSCs, thereby improving the carrier transport dynamics. Finally, this viable industrialization strategy boosted the PCE of MA0.85FA0.15PbI3 PSCs from 15.3 % to 17.86 %, which was prepared without spin-coating fragile self-assembled monolayers (SAMs) under open-air conditions, demonstrating promising potential for commercial applications.
顺序磁控溅射法制备CuOx/NiOx复合空穴传输层,制备高效稳定的钙钛矿太阳能电池
磁控溅射无机NiOx空穴传输层(HTL)具有大面积制备和高工艺可控性等优点,已成为钙钛矿太阳能电池(PSCs)工业生产的一种实用方法。然而,HTL相对较差的电导率和较高的缺陷密度阻碍了器件性能的进一步提高。为了解决上述问题,本文创新性地采用Cu和NiO靶材顺序溅射的方法制备了CuOx/NiOx复合材料HTL,且易于工业化生产。随后,通过对溅射工艺参数(时间、气氛、退火温度)的优化,复合HTL表现出优于单一NiOx的光电性能。同时,CuOx的引入有效地降低了PSCs的缺陷密度,从而改善了载流子输运动力学。最后,这种可行的工业化策略将MA0.85FA0.15PbI3 PSCs的PCE从15.3%提高到17.86%,在露天条件下制备了无自旋涂层的脆弱自组装单层(SAMs),显示出良好的商业应用潜力。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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