{"title":"Solution‐Processed Bi2S3 Nanostructures for Flexible Memory and Neuromorphic Computing","authors":"Sayali Shrishail Harke, Omesh Kapur, Peng Dai, Tongjun Zhang, Bingkai Ding, Bohao Ding, Ruomeng Huang, Chitra Gurnani","doi":"10.1002/aelm.202500370","DOIUrl":null,"url":null,"abstract":"The rapid advancement of wearable computing and edge AI technologies is driving the need for low‐temperature, flexible, and neuromorphic‐compatible electronic materials. In this work, the successful low‐temperature deposition of Bi<jats:sub>2</jats:sub>S<jats:sub>3</jats:sub> thin films via an in situ solvothermal method using the single‐source precursor (SSP) [Bi(S<jats:sub>2</jats:sub>P(OC<jats:sub>3</jats:sub>H₇)<jats:sub>2</jats:sub>)<jats:sub>3</jats:sub>] is reported. This solution‐processed approach enables the formation of high‐quality, crystalline, and stoichiometric Bi<jats:sub>2</jats:sub>S<jats:sub>3</jats:sub> films over a broad temperature window (140–200 °C), compatible with a range of substrates including silicon, polyimide, and PET. Leveraging this deposition technique, Bi<jats:sub>2</jats:sub>S<jats:sub>3</jats:sub>‐based memristors are fabricated on both rigid and flexible substrates. The devices exhibit stable resistive switching behavior and demonstrate mechanical and electrical robustness under stress conditions. Furthermore, the memristors effectively emulate long‐term synaptic plasticity, achieving high learning accuracy. These findings establish SSP‐derived Bi<jats:sub>2</jats:sub>S<jats:sub>3</jats:sub> films as a promising material platform for next‐generation flexible neuromorphic computing and memory technologies.","PeriodicalId":110,"journal":{"name":"Advanced Electronic Materials","volume":"18 1","pages":""},"PeriodicalIF":5.3000,"publicationDate":"2025-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Electronic Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/aelm.202500370","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The rapid advancement of wearable computing and edge AI technologies is driving the need for low‐temperature, flexible, and neuromorphic‐compatible electronic materials. In this work, the successful low‐temperature deposition of Bi2S3 thin films via an in situ solvothermal method using the single‐source precursor (SSP) [Bi(S2P(OC3H₇)2)3] is reported. This solution‐processed approach enables the formation of high‐quality, crystalline, and stoichiometric Bi2S3 films over a broad temperature window (140–200 °C), compatible with a range of substrates including silicon, polyimide, and PET. Leveraging this deposition technique, Bi2S3‐based memristors are fabricated on both rigid and flexible substrates. The devices exhibit stable resistive switching behavior and demonstrate mechanical and electrical robustness under stress conditions. Furthermore, the memristors effectively emulate long‐term synaptic plasticity, achieving high learning accuracy. These findings establish SSP‐derived Bi2S3 films as a promising material platform for next‐generation flexible neuromorphic computing and memory technologies.
期刊介绍:
Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.