Formation of Porous Silicon Oxides for Single-Layer Anti-reflection Coatings on Transparent Materials Using Atmospheric-Pressure Very High-Frequency Plasma

IF 2.5 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL

Plasma Chemistry and Plasma Processing Pub Date : 2025-03-28 DOI:10.1007/s11090-025-10559-y

Leapheng Uon, Naoto Mizusawa, Reo Yamauchi, Hiromasa Ohmi, Hiroaki Kakiuchi

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引用次数: 0

Abstract

We study a formation process of single-layer anti-reflection coatings using porous silicon oxide (SiO_x) films formed in atmospheric-pressure (AP), very high-frequency (VHF) plasma. A two-step process is proposed for forming porous SiO_x films: deposition of carbon and hydrogen-containing silicon oxide (SiOCH) layers on a substrate on which polystyrene nanospheres are pre-arranged in hexamethyldisiloxane and hydrogen-fed AP-VHF plasma and subsequent removal of the polystyrene nanospheres/transformation of the SiOCH layer into inorganic SiO_x one by post-oxidation in oxygen-fed AP-VHF plasma. Transmission electron microscopy and energy dispersive X-ray analyses have confirmed that the polystyrene nanospheres underlying the SiOCH layer are effectively removed by the post-oxidation and that air is introduced into the place where the polystyrene nanospheres are present, which are supported by the optical reflectance measurements. The reaction mechanism during the post-oxidation process is discussed, based on the Fourier transform infrared adsorption spectroscopy measurements.

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常压甚高频等离子体制备透明材料单层增透涂层用多孔氧化硅

我们研究了在常压（AP）甚高频（VHF）等离子体中形成多孔氧化硅（SiOx）薄膜的单层增透涂层的形成过程。提出了一种制备多孔SiOx薄膜的两步工艺：将碳和含氢氧化硅（SiOCH）层沉积在聚苯乙烯纳米球预先排列在六甲基二硅氧烷和加氢AP-VHF等离子体中的衬底上，随后在加氢AP-VHF等离子体中去除聚苯乙烯纳米球/将SiOCH层转化为无机SiOx层。透射电子显微镜和能量色散x射线分析证实，氧化后氧化有效地除去了SiOCH层下的聚苯乙烯纳米球，并且空气被引入到聚苯乙烯纳米球存在的地方，这得到了光学反射测量的支持。基于傅里叶变换红外吸附光谱测量，讨论了后氧化过程中的反应机理。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.