Synergistic Modulation of Polarization and Leakage Current in MPB-HZO Capacitors via TiO2 Interlayer

IF 5.3 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Changhyeon Han, Been Kwak, Joonhyeok Choi, Sung-Wook Park, Dahye Yu, Minsuk Song, Rino Choi, Daewoong Kwon
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引用次数: 0

Abstract

To address critical reliability concerns in ferroelectric devices, the role of a TiO2 interlayer in modulating the electrical characteristics of HfxZr1-xO2 (HZO)-based metal-ferroelectric-metal (MFM) capacitors near the morphotropic phase boundary (MPB) is investigated. The TiO2 interlayer is inserted at the HZO interface to selectively modulate defect behavior while preserving the desired MPB phase composition. Electrical, structural, and spectroscopic analyses reveal that TiO2 integration enables 1) suppression of leakage pathways, 2) stabilization of polarization with enhanced dielectric response, 3) modulation of oxygen vacancy (VO) distribution, and 4) reduction of low-frequency noise (LFN) amplitude. These synergistic effects collectively improve the reliability and energy efficiency of MPB-HZO capacitors, offering a promising interface-engineering strategy for next-generation ferroelectric DRAM technologies.

Abstract Image

TiO2中间层协同调制MPB-HZO电容器的极化和漏电流
为了解决铁电器件中关键的可靠性问题,研究了TiO2中间层在调节HfxZr1-xO2 (HZO)基金属-铁电-金属(MFM)电容器在致形相边界(MPB)附近的电特性中的作用。在HZO界面上插入TiO2中间层,以选择性地调制缺陷行为,同时保持所需的MPB相组成。电学、结构和光谱分析表明,TiO2集成可以抑制泄漏途径,通过增强介电响应稳定极化,3)调制氧空位(VO)分布,4)降低低频噪声(LFN)振幅。这些协同效应共同提高了MPB-HZO电容器的可靠性和能效,为下一代铁电DRAM技术提供了一种有前途的接口工程策略。
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来源期刊
Advanced Electronic Materials
Advanced Electronic Materials NANOSCIENCE & NANOTECHNOLOGYMATERIALS SCIE-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
11.00
自引率
3.20%
发文量
433
期刊介绍: Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.
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