A practical guide to electrical characterization of interface states: Case studies on SiC and GaN

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zilan Wang , Hongling Wu , Haoyang Li , Jiaxuan Yang , Francis C.C. Ling , Lai Wang
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引用次数: 0

Abstract

SiC and GaN have garnered significant attention from both academia and industry due to their promising applications. However, interface states in these devices have become a critical performance-limiting factor. Furthermore, as novel device architectures continue to evolve, the characterization of interface states presents increasingly complex challenges. Among available techniques, electrical defect characterization methods have emerged as indispensable tools for investigating interface states due to their non-destructive nature, rapid measurement capabilities, cost-effectiveness, and ability to provide comprehensive parameters—including energy distribution, energy levels, and capture cross-sections. This tutorial highlights three widely used electrical characterization techniques for interface state analysis: capacitance-voltage (CV) profiling, the conductance method, and constant-capacitance deep-level transient spectroscopy (CC-DLTS). Each technique has demonstrated value within specific measurement ranges, and practical experience suggests that combining multiple approaches often yields the most reliable results. The discussion includes fundamental principles, implementation considerations, and case studies from actual device measurements, aiming to provide experimental researchers with practical guidance. With a focus on SiC and GaN, this guide seeks to offer actionable starting points for characterizing interface states, particularly for those new to these measurement techniques.
界面状态电特性的实用指南:SiC和GaN的案例研究
碳化硅和氮化镓因其具有广阔的应用前景而受到学术界和工业界的广泛关注。然而,这些设备中的接口状态已经成为一个关键的性能限制因素。此外,随着新型器件架构的不断发展,界面状态的表征也面临着越来越复杂的挑战。在现有的技术中,电缺陷表征方法已经成为研究界面状态不可或缺的工具,因为它们具有非破坏性、快速测量能力、成本效益和提供全面参数的能力,包括能量分布、能级和捕获截面。本教程重点介绍了用于界面状态分析的三种广泛使用的电表征技术:电容-电压(CV)分析,电导方法和恒电容深层瞬态光谱(cc - dts)。每种技术都在特定的测量范围内证明了价值,实践经验表明,结合多种方法通常会产生最可靠的结果。讨论包括基本原理、实施考虑和实际设备测量的案例研究,旨在为实验研究人员提供实用指导。以SiC和GaN为重点,本指南旨在为表征界面状态提供可操作的起点,特别是对于那些新的测量技术。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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