{"title":"Deep Kernel-Based Hyperparameter Adaptive Learning and Frequency Response Predictions Using Transposed Convolutional Neural Network","authors":"Yiliang Guo;Yifan Wang;Joshua Corsello;Madhavan Swaminathan","doi":"10.1109/TCPMT.2025.3578968","DOIUrl":null,"url":null,"abstract":"Electronic design automation (EDA) has unique challenges for addressing the design of systems for emerging applications due to the complexities involved, where multiple chiplets are integrated together on a heterogeneous platform. This challenge arises due to the long computation time required for simulation to capture all the necessary first order, second order, and sometimes third-order parasitic effects. Emerging machine learning (ML) and Gaussian process (GP) methods have helped expedite these processes. The deep kernel learning (DKL) model combines the structural properties of deep learning architectures with the nonparametric flexibility of kernel methods. It shows advantages by applying a GP with the corresponding kernel function to the final hidden layer of a deep neural network (DNN). However, DKL sometimes suffers from overfitting and scalability issues. In this article, we propose an adaptive learning framework for <italic>S</i>-parameter prediction, incorporating the spectral transposed convolutional neural network (S-TCNN) and DKL. The proposed model takes input parameters from the design space, upsamples them through transposed convolutional layers, and utilizes a GP kernel layer to approximate the desired kernel function. Additionally, the latent feature space adaptively compresses and extracts features from the input matrix, serving as a separate input parameter for the GP kernel layer. Further, we discuss the training strategy and model scalability. The proposed model is tested and evaluated using two advanced packaging examples. Results show a reduction in the number of hyperparameters by over 50% and approximately 40% improvements in loss and normalized mean-square error (NMSE).","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1964-1972"},"PeriodicalIF":3.0000,"publicationDate":"2025-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11031455/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Electronic design automation (EDA) has unique challenges for addressing the design of systems for emerging applications due to the complexities involved, where multiple chiplets are integrated together on a heterogeneous platform. This challenge arises due to the long computation time required for simulation to capture all the necessary first order, second order, and sometimes third-order parasitic effects. Emerging machine learning (ML) and Gaussian process (GP) methods have helped expedite these processes. The deep kernel learning (DKL) model combines the structural properties of deep learning architectures with the nonparametric flexibility of kernel methods. It shows advantages by applying a GP with the corresponding kernel function to the final hidden layer of a deep neural network (DNN). However, DKL sometimes suffers from overfitting and scalability issues. In this article, we propose an adaptive learning framework for S-parameter prediction, incorporating the spectral transposed convolutional neural network (S-TCNN) and DKL. The proposed model takes input parameters from the design space, upsamples them through transposed convolutional layers, and utilizes a GP kernel layer to approximate the desired kernel function. Additionally, the latent feature space adaptively compresses and extracts features from the input matrix, serving as a separate input parameter for the GP kernel layer. Further, we discuss the training strategy and model scalability. The proposed model is tested and evaluated using two advanced packaging examples. Results show a reduction in the number of hyperparameters by over 50% and approximately 40% improvements in loss and normalized mean-square error (NMSE).
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.