{"title":"A Lifetime Prediction Method of IGBT Based on Phased Nonlinear Wiener Process","authors":"Anran Hua;Yanbo Che;Peiyi Li;Mengxiang Zheng","doi":"10.1109/TDMR.2025.3575598","DOIUrl":null,"url":null,"abstract":"The Insulated Gate Bipolar Transistor (IGBT) is a critical component of power electronic devices, and its reliability significantly impacts the overall system performance. To enhance IGBT reliability assessment in the context of modular multilevel converters (MMCs), this study proposes a remaining useful life (RUL) prediction method based on a phased nonlinear Wiener process. By analyzing the failure mechanisms of IGBTs, the turn-off peak voltage and the collector-emitter saturation voltage are identified as key degradation indicators. A piecewise nonlinear Wiener degradation model is employed for RUL prediction, with gradient change detection method used to dynamically determine segmentation points. The proposed model accounts for the stochastic effects of the drift coefficient and measurement errors, with Kalman filtering algorithm applied to update random parameters in real time. Based on accelerated aging test data, the proposed method is compared with the standard Wiener model, the Wiener model considering only drift coefficient randomness, and other recent RUL prediction methods that do not rely on the Wiener process. The results demonstrate that the proposed approach achieves higher prediction accuracy and computational efficiency, particularly in scenarios with significant fluctuations in degradation indicators, making it highly promising for engineering applications.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 3","pages":"545-556"},"PeriodicalIF":2.3000,"publicationDate":"2025-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11020803/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The Insulated Gate Bipolar Transistor (IGBT) is a critical component of power electronic devices, and its reliability significantly impacts the overall system performance. To enhance IGBT reliability assessment in the context of modular multilevel converters (MMCs), this study proposes a remaining useful life (RUL) prediction method based on a phased nonlinear Wiener process. By analyzing the failure mechanisms of IGBTs, the turn-off peak voltage and the collector-emitter saturation voltage are identified as key degradation indicators. A piecewise nonlinear Wiener degradation model is employed for RUL prediction, with gradient change detection method used to dynamically determine segmentation points. The proposed model accounts for the stochastic effects of the drift coefficient and measurement errors, with Kalman filtering algorithm applied to update random parameters in real time. Based on accelerated aging test data, the proposed method is compared with the standard Wiener model, the Wiener model considering only drift coefficient randomness, and other recent RUL prediction methods that do not rely on the Wiener process. The results demonstrate that the proposed approach achieves higher prediction accuracy and computational efficiency, particularly in scenarios with significant fluctuations in degradation indicators, making it highly promising for engineering applications.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.