{"title":"Design of 2T DRAM Cell With Surrounding Poly-Si Capacitor for Enhanced Retention and Mitigated Coupling Effect","authors":"Seonghwan Kong;Wonbo Shim","doi":"10.1109/TDMR.2025.3578692","DOIUrl":null,"url":null,"abstract":"Two-transistors-zero-capacitor (2T0C) DRAM-based processing-in-memory (PIM) system experiences retention degradation and capacitive coupling effects because of its volatile characteristics and capacitorless structure. These challenges result in degraded reliability and significant energy consumption due to frequent refresh operations. In this work, we propose a cell structure with surrounding polycrystalline silicon capacitor (poly-Cap.) to enhance the storage node capacitance of the vertical-transistor on gate (VTG) DRAM cell introduced in our previous work. The poly-Cap. improves the retention characteristics and mitigates the capacitive coupling effects while maintaining its unit cell area. We modeled the VTG DRAM cell with the poly-Cap. and analyzed its device characteristics using TCAD simulations. Additionally, we evaluated the inference accuracy of the 2T DRAM-based PIM system using a customized simulation framework. We confirmed that the poly-Cap. increased the storage node capacitance by 31.9%, improved the retention characteristics by 83.3% and reduced the capacitive coupling effects by 52.4% during the write ‘1’ operation and 27.3% during the read ‘1’ operation.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 3","pages":"460-464"},"PeriodicalIF":2.3000,"publicationDate":"2025-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11030837/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Two-transistors-zero-capacitor (2T0C) DRAM-based processing-in-memory (PIM) system experiences retention degradation and capacitive coupling effects because of its volatile characteristics and capacitorless structure. These challenges result in degraded reliability and significant energy consumption due to frequent refresh operations. In this work, we propose a cell structure with surrounding polycrystalline silicon capacitor (poly-Cap.) to enhance the storage node capacitance of the vertical-transistor on gate (VTG) DRAM cell introduced in our previous work. The poly-Cap. improves the retention characteristics and mitigates the capacitive coupling effects while maintaining its unit cell area. We modeled the VTG DRAM cell with the poly-Cap. and analyzed its device characteristics using TCAD simulations. Additionally, we evaluated the inference accuracy of the 2T DRAM-based PIM system using a customized simulation framework. We confirmed that the poly-Cap. increased the storage node capacitance by 31.9%, improved the retention characteristics by 83.3% and reduced the capacitive coupling effects by 52.4% during the write ‘1’ operation and 27.3% during the read ‘1’ operation.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.