{"title":"The First Switch Effect in Ferroelectric Field-Effect Transistors","authors":"Priyankka Ravikumar;Prasanna Venkatesan;Chinsung Park;Nashrah Afroze;Mengkun Tian;Winston Chern;Suman Datta;Shimeng Yu;Souvik Mahapatra;Asif Khan","doi":"10.1109/TDMR.2025.3576042","DOIUrl":null,"url":null,"abstract":"In this work, a ferroelectric field-effect transistor (FEFET) is systematically characterized and compared with an equivalent standard MOSFET with an equivalent oxide thickness. We show that these two devices, with a silicon channel, exhibit similar pristine state transfer characteristics but starkly different endurance characteristics. In contrast to the MOSFET, the FEFET shows a significant increase in sub-threshold swing in the first write pulse. Based on this, we reveal that this first write pulse (cycle 1) generates more than half of the total traps generated during the fatigue cycling in FEFETs. We call this the “First Switch Effect”. Further, by polarizing a pristine FEFET step by step, we demonstrate a direct correlation between the switched polarization and interface trap density during the first switch. Through charge pumping measurements, we also observe that continued cycling generates traps more towards the bulk of the stack, away from the Si/SiO2 interface in FEFETs. We establish that: (1) the first switch effect leads to approximately 50% of the total trap density (Nit) near the Si/SiO2 interface until memory window closure; and (2) further bipolar cycling leads to trap generation both at and away from Si/SiO2 interface in FEFETs.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 3","pages":"365-370"},"PeriodicalIF":2.3000,"publicationDate":"2025-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11021438/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, a ferroelectric field-effect transistor (FEFET) is systematically characterized and compared with an equivalent standard MOSFET with an equivalent oxide thickness. We show that these two devices, with a silicon channel, exhibit similar pristine state transfer characteristics but starkly different endurance characteristics. In contrast to the MOSFET, the FEFET shows a significant increase in sub-threshold swing in the first write pulse. Based on this, we reveal that this first write pulse (cycle 1) generates more than half of the total traps generated during the fatigue cycling in FEFETs. We call this the “First Switch Effect”. Further, by polarizing a pristine FEFET step by step, we demonstrate a direct correlation between the switched polarization and interface trap density during the first switch. Through charge pumping measurements, we also observe that continued cycling generates traps more towards the bulk of the stack, away from the Si/SiO2 interface in FEFETs. We establish that: (1) the first switch effect leads to approximately 50% of the total trap density (Nit) near the Si/SiO2 interface until memory window closure; and (2) further bipolar cycling leads to trap generation both at and away from Si/SiO2 interface in FEFETs.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.