A quantitative analysis and testing assessment method for functional damage state of electronic circuits under impact loads

IF 1.9 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-09-12 DOI:10.1016/j.microrel.2025.115905

Dahai Li , Li Long , Peng Peng , Zhaodong Lin , Yongjian Zhang , Cong Xu , Changan Di , Junsong Ren

引用次数: 0

Abstract

Focusing on the assessment of the functional damage state in electronic circuits under impact loads, this paper conducted research encompassing the analysis of damage scenarios, quantitative calculation of functional damage probabilities, and the construction of damage probability curve. Additionally, we developed a comprehensive set of quantitative analysis methods for assessing the functional damage state of electronic circuits. We designed a board-level drop impact test and monitored the dynamic response curves of circuit signals under impact loads in real time. Finally, we constructed the functional damage probability curve using the damage characteristic data from the circuit signals. These results verify the reasonableness and effectiveness of the proposed quantitative analysis and testing assessment method.

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冲击载荷作用下电子电路功能损伤状态的定量分析与试验评估方法

针对冲击载荷作用下电子电路的功能损伤状态评估，进行了损伤情景分析、功能损伤概率定量计算、损伤概率曲线构建等方面的研究。此外，我们还开发了一套全面的定量分析方法来评估电子电路的功能损伤状态。设计了板级跌落冲击试验，实时监测了冲击载荷作用下电路信号的动态响应曲线。最后，利用电路信号的损伤特征数据，构造了功能损伤概率曲线。这些结果验证了所提出的定量分析和测试评价方法的合理性和有效性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.