Yushuang He;Feipeng Wang;Hongming Yang;Archie James Johnston;Xiao Zhang;Jian Li
{"title":"Monitoring Metallized Film Capacitor Health: A Method for Estimating Capacitance Amid Short-Term Failures Due to Self-Healing","authors":"Yushuang He;Feipeng Wang;Hongming Yang;Archie James Johnston;Xiao Zhang;Jian Li","doi":"10.1109/TDMR.2025.3572512","DOIUrl":null,"url":null,"abstract":"Metallized film capacitors (MFCs) are valued for their ability to withstand high-electric-fields, yet they face short-term failure risks when subjected to overvoltage-induced self-healing (SH). This paper presents a monitoring method designed to address the challenges posed by multiple instances of SH in pulsed power applications. Traditional capacitance estimation using sampled current during SH is hindered by the significant arc current. To address this, the study explores the dynamic interplay between sampling current, arc current, and MFC current throughout the SH process. The introduction of Kalman filtering effectively mitigates the impact of noise signals on capacitance monitoring during the short-term cumulative discharge process of SH. Experimental and simulation results attest to the efficiency of the proposed approach, demonstrating an estimation error of less than 1%. Furthermore, a thorough structural analysis of MFCs demonstrates that the proposed method can effectively identify the transition from isolated, safe SH behavior to clustered, disruptive SH events, thereby enabling timely intervention to prevent severe damage.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"25 3","pages":"638-648"},"PeriodicalIF":2.3000,"publicationDate":"2025-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11010092/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Metallized film capacitors (MFCs) are valued for their ability to withstand high-electric-fields, yet they face short-term failure risks when subjected to overvoltage-induced self-healing (SH). This paper presents a monitoring method designed to address the challenges posed by multiple instances of SH in pulsed power applications. Traditional capacitance estimation using sampled current during SH is hindered by the significant arc current. To address this, the study explores the dynamic interplay between sampling current, arc current, and MFC current throughout the SH process. The introduction of Kalman filtering effectively mitigates the impact of noise signals on capacitance monitoring during the short-term cumulative discharge process of SH. Experimental and simulation results attest to the efficiency of the proposed approach, demonstrating an estimation error of less than 1%. Furthermore, a thorough structural analysis of MFCs demonstrates that the proposed method can effectively identify the transition from isolated, safe SH behavior to clustered, disruptive SH events, thereby enabling timely intervention to prevent severe damage.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.