Liwei Fan , Yijia Wang , Yongbing Zhou , Jian Zhang , Haojie Chen
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引用次数: 0
Abstract
Ball Grid Array (BGA) surface defect detection is critical for ensuring the safety and reliability of electronic products. In recent years, numerous deep learning-based BGA surface defect detection algorithms have achieved significant detection performance in this field. However, the computational complexity of existing high-precision models has limited their application in real-time detection on industrial production lines. To address this issue, this paper proposes a lightweight detection architecture based on You Only Look Once v8 (YOLOv8), named YOLO-ADown and Partial Group-shuffle Cross-scale Feature Fusion (YOLO-APGC), which aims to significantly reduce the number of model parameters and computational costs while maintaining high detection accuracy. First, in the feature extraction stage, Adaptive Downsampling (ADown) is introduced, and a novel lightweight Double Partial-Block (PP-Block) module is constructed to synergistically optimize the information retention efficiency and computational cost during the high-dimensional feature compression process. Then, to achieve efficient fusion of multi-scale features, a novel cross-scale dynamic feature fusion network, the Partial Group-shuffle Cross-scale Feature Fusion Network (PG-CCFN), is proposed. Finally, a new BGA dataset is constructed based on industrial scenarios, and a series of experiments are conducted. The results show that the number of parameters in YOLO-APGC is reduced by 68.21 % compared to the baseline model. Additionally, the Giga Floating-point Operations Per Second (GFLOPs) is reduced by 54.32 %, and the Frames Per Second (FPS) is improved by 9.1 %. This model offers a low-cost, highly robust intelligent quality inspection solution for the microelectronics packaging industry, providing significant engineering value in ensuring the long-term reliability of microelectronics packaging.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.