Mengqi Chen , Yuting Wang , Jie Chen , Qing Hao , Xin Ju
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引用次数: 0
Abstract
Quantum cascade detectors (QCDs) exhibit significant application potential in the infrared to terahertz spectral range due to their intersubband transition properties. However, limitations such as interface scattering and atomic-scale structure instability in traditional cascade structures hinder the improvement of their respond performance. In this study, GaAs/AlGaAs-based QCD samples with a four-well cascade structure (FWCS) and two multi-stage coupled structures (MSCS-1 and MSCS-2) were fabricated using molecular beam epitaxy (MBE). The correlation mechanisms between the atomic-scale structure of heterojunctions and respond performance were systematically analyzed through X-ray diffraction (XRD), synchrotron radiation X-ray absorption spectroscopy (SR-XAS), and band structure simulations. XRD and XAS collectively confirmed that the heterojunction interface bond length consistency in the MBE-grown FWCS and MSCS samples achieved atomic-scale precision, with a material parameter deviation of only 0.8 % from theoretical design. Respond performance experiments and band structure simulations demonstrated that MSCS-1 and MSCS-2 achieved 3-5 orders of magnitude enhancement in dark current density and blackbody-induced response current density compared to FWCS, which attribute the multi-stage coupled structure enhances energy level coupling in the transport region, forming a miniband transport that significantly improves carrier transport efficiency. Specifically, MSCS-2 due to its optimized energy level alignment, exhibited a blackbody-induced response current density of 1.45 × 10−4 A cm−2 under a −1 V bias and a reduced activation energy of 102 meV. This study provides critical theoretical support for the band engineering and structural design of high-performance QCDs.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
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Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.