A Semiopen Substrate Integrated Horn Antenna With Dielectric Loading in 300 GHz Band

IF 3.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Prabir Garu;Zhao-Hong Tu;Sheng-Chun Tsao;Chih-Han Lin;Yu-Hsiang Cheng
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引用次数: 0

Abstract

This study proposes a high-gain, broadband planar horn antenna that can be fabricated using standard printed circuit board technologies. The exponential tapering of the horn structure ensures wide bandwidth, while the semiopen structure and dielectric loading facilitate a smooth transition between the substrate-integrated waveguide and free space. A broadband transition between the substrate-integrated waveguide and the rectangular waveguide is also included for measurement purposes. The fabricated antenna exhibits an impedance bandwidth ranging from 220 to 303.3 GHz. With an end-fire radiation pattern, the antenna achieves a measured peak realized gain of 16.8 dBi, with a 3 dB beamwidth of 11$^\circ$ in the H-plane and 17$^\circ$ in the E-plane. This broadband, high-gain antenna is highly promising for operation within channel 68, as defined by the IEEE 802.15.3 d standard.
300 GHz频段介电载荷半开式基片集成喇叭天线
本研究提出了一种高增益、宽带平面喇叭天线,可以使用标准印刷电路板技术制造。喇叭结构的指数锥形保证了宽带宽,而半开放式结构和介电负载促进了基片集成波导和自由空间之间的平滑过渡。衬底集成波导和矩形波导之间的宽带转换也包括用于测量目的。该天线的阻抗带宽范围为220 ~ 303.3 GHz。在发射端辐射方向图中,该天线的峰值实现增益为16.8 dBi, h平面的3db波束宽度为11$^\circ$, e平面的波束宽度为17$^\circ$。根据IEEE 802.15.3 d标准的定义,这种宽带高增益天线在信道68内运行非常有希望。
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来源期刊
IEEE Transactions on Terahertz Science and Technology
IEEE Transactions on Terahertz Science and Technology ENGINEERING, ELECTRICAL & ELECTRONIC-OPTICS
CiteScore
7.10
自引率
9.40%
发文量
102
期刊介绍: IEEE Transactions on Terahertz Science and Technology focuses on original research on Terahertz theory, techniques, and applications as they relate to components, devices, circuits, and systems involving the generation, transmission, and detection of Terahertz waves.
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