A Review of Prognostics Methods for Electronic Packages: From a Structure-Aware System-Level Perspective

Abstract

Prognostics for electronic packages is an evolving field critical to predicting the reliability and lifespan of electronic systems. This article proposes a novel “structure-aware system-level (SASL)” approach, addressing the limitations of traditional methods that treat components or subsystems as isolated black boxes. SASL examines how individual component degradation propagates, interacts within the package structure, and collectively determines the system's lifetime. The article reviews three key areas: component-level prognostics, package structure, and system-level analysis, offering guidance for future research. It advocates interdisciplinary collaboration to develop practical and interpretable prognostics methods, driving innovation in industries reliant on complex electronic systems.