Oxidation and atomic migration between CuOy and SnOx layers magnetron sputtered on polyethylene terephthalate

IF 2 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS

Thin Solid Films Pub Date : 2025-08-29 DOI:10.1016/j.tsf.2025.140782

Adriana Ventolero , Ma. Guadalupe Olayo , Elena Colín , J. Cuauhtémoc Palacios , Fernando G. Flores , Rosario Ramírez , Guillermo J. Cruz

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引用次数: 0

Abstract

Alternated bilayers of tin (SnO_x) and copper (CuO_y) oxides were synthesized by reactive magnetron sputtering on polyethylene terephthalate (PET) to study the atomic interlayer migration and oxidation states. The total thickness of the bilayers was between 468 and 482 nm. The thickness of sublayers and interfaces were calculated by continuous erosion with Ar ions, finding 86 nm in PET-CuO_y, 34 nm in SnO_x-CuO_y and 57 nm in CuO_y-SnO_x. It was found Cu atomic interlayer migration to its neighbors but not Sn migration. The metallic chemical states were studied by means of the energetic distribution of Cu2p3/2, Sn3d5/2 and O1s orbitals. In the SnO_x-CuO_y bilayer, CuO_y oxides formed during the sputtering showed 5 chemical states with y = 0 (56.5 %), 0.6 (19.0 %), 1.2 (10.1 %), 1.9 (5.8 %) and 2.6 (2.0 %); and when it diffused into the SnO_x layer, 4 chemical states were formed with y = 0.3 (53.9 %), 1.0 (18.6 %), 1.7 (8.2 %) and 2.4 (only at 0 s of erosion with 7.8 %). These numbers suggest different oxidation in Cu when it is formed directly from the sputtering in an oxygen atmosphere and when it diffuses among the metallic layers. In SnO_x, 3 Sn chemical states were found with x = 0.4 (3.8 %), 1.8 (93.5 %) and 3.3 (2.7 %) without migration to the Cu layer. From a global point of view, O/Cu and O/Sn atomic ratios showed different values from those relative to their respective chemical valences.

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聚对苯二甲酸乙二醇酯磁控溅射CuOy和SnOx层之间的氧化和原子迁移

采用反应磁控溅射法在聚对苯二甲酸乙二醇酯（PET）上合成了锡（SnOx）和铜（CuOy）氧化物的交替双层，研究了原子层间迁移和氧化态。双层膜的总厚度在468 ~ 482 nm之间。通过连续侵蚀氩离子计算亚层厚度和界面厚度，PET-CuOy为86 nm， SnOx-CuOy为34 nm， cuy - snox为57 nm。发现Cu原子在层间向相邻原子迁移，而Sn原子没有迁移。利用Cu2p3/2、Sn3d5/2和O1s轨道的能量分布研究了金属化学态。在SnOx-CuOy双分子层中，溅射形成的CuOy氧化物呈现出5种化学态，分别为y = 0（56.5%）、0.6（19.0%）、1.2（10.1%）、1.9（5.8%）和2.6 (2.0%)；扩散到SnOx层时，形成y = 0.3（53.9%）、1.0（18.6%）、1.7（8.2%）和2.4（仅在侵蚀0 s时为7.8%）4种化学态。这些数字表明，当铜在氧气气氛中直接溅射形成时，以及当它在金属层之间扩散时，其氧化程度不同。SnOx中存在3种Sn的化学态，分别为x = 0.4（3.8%）、1.8（93.5%）和3.3(2.7%)，未向Cu层迁移。从整体上看，O/Cu和O/Sn的原子比与它们各自的化学价的原子比不同。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thin Solid Films 工程技术-材料科学：膜

CiteScore

4.00

自引率

4.80%

发文量

381

审稿时长

7.5 months

期刊介绍： Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.