A Transfer Bonding Technology for Advanced 2.5-D Integration With Reduced Warpage and Improved Stacking Flexibility

IF 4.5 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Electron Device Letters Pub Date : 2025-07-10 DOI:10.1109/LED.2025.3587748

Yu-Lun Liu;Chao-Kai Hsu;Chih-Cheng Hsiao;Chun-Ta Li;Jia-Rui Lin;Kuan-Neng Chen

引用次数: 0

Abstract

A transfer bonding technology for advanced 2.5D integration with reduced warpage and improved stacking flexibility is presented. Molding-based and multi-RDL-layer based layer transfer are demonstrated for multiple stacking, both enabling high-density interposer integration without the need for CMP or complex lithography. Structural and electrical reliability is validated through optical inspection, SAT, SEM, and daisy-chain testing. Warpage measurements confirm a significant reduction across key process steps. The proposed transfer bonding technology provides a scalable and manufacturable solution for next-generation advanced packaging and heterogeneous integration.

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先进的2.5维集成传输键合技术，减少翘曲和提高堆叠灵活性

提出了一种减少翘曲和提高堆垛灵活性的先进2.5D集成转移键合技术。基于成型的和基于多rdl层的层转移被证明可以进行多次堆叠，两者都可以实现高密度的中间层集成，而无需CMP或复杂的光刻。通过光学检查、SAT、SEM和菊花链测试验证了结构和电气可靠性。翘曲测量确认了关键工艺步骤的显著减少。提出的转移键合技术为下一代先进封装和异构集成提供了可扩展和可制造的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Electron Device Letters 工程技术-工程：电子与电气

CiteScore

8.20

自引率

10.20%

发文量

551

审稿时长

1.4 months

期刊介绍： IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.