High-Performance Charge Trapping Memories Achieved by Heterogeneous Interface Polarization

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Puhao Chai;Jun Zhu;Jiale Chen;Zihao Wang
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Abstract

The rapid development of modern electronic technology has created an urgent demand for high-density nonvolatile memory. To address this challenge, we propose a method that leverages the Maxwell–Wagner interface polarization effect to enhance the performance of charge trapping memory (CTM). By employing Al2O3 /LaTiO3 stacked structures with differing dielectric constants as charge trapping layers (CTLs), we create abundant trapping sites and significantly boost the charge trapping capability. The memory properties were systematically investigated and compared with different interface devices. Our device shows excellent memory performance with a 20.06 V memory window and a $4.9\times 10^{{13}}$ /cm2 charge trapping density at ±12 V sweep voltage, 91.2% charge retention after ten years, and stable frequency performance. These superior memory properties arise from the trapped charges that accumulate at heterogeneous interfaces to balance the electric field. Furthermore, additional thinner interfacial structures lead to a decline in memory performance due to atomic thermal diffusion. This study offers a promising approach for high-density nonvolatile memories.
异质界面极化实现高性能电荷捕获存储器
现代电子技术的飞速发展对高密度非易失性存储器提出了迫切的需求。为了解决这一挑战,我们提出了一种利用麦克斯韦-瓦格纳界面极化效应来提高电荷捕获存储器(CTM)性能的方法。通过采用不同介电常数的Al2O3 /LaTiO3堆叠结构作为电荷捕获层(ctl),我们创造了丰富的捕获位点,显著提高了电荷捕获能力。对不同接口器件的存储性能进行了系统的研究和比较。该器件在±12 V扫描电压下具有20.06 V的记忆窗口和$4.9\times 10^{{13}}$ /cm2的电荷捕获密度,10年后电荷保留率为91.2%,频率性能稳定。这些优越的记忆特性来自于在异质界面积聚的捕获电荷以平衡电场。此外,由于原子热扩散,更薄的界面结构导致存储性能下降。该研究为高密度非易失性存储器提供了一种有前途的方法。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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