Impact of Channel Material, Interface Quality, and Polarization on Memory Window of Interfacial Layer-Free FeFET With Oxide Semiconductor

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zikang Yao;Danyang Chen;Tianning Cui;Yulong Dong;Zhiyu Lin;Jingquan Liu;Mengwei Si;Xiuyan Li
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引用次数: 0

Abstract

This study systematically investigates the modulation of the memory window (MW) in interfacial layer (IL)-free and Hfx $Zr_{{1}-{x}}$ O2 (HZO)-based ferroelectric field-effect transistors (FeFETs) with oxide channel by engineering oxide semiconductor materials, annealing processes, and polarization in HZO. Our findings reveal that the MW in such an FeFET is predominantly governed by the positive charge supply capability of the semiconductor layer and the interface properties between the ferroelectric (FE) layer and the semiconductor. Specifically, higher doping concentrations in the channel material and less interface trapping are shown to enhance the MW. In contrast, polarization shows limited effect. These results provide critical insights into the underlying mechanisms of MW optimization in FeFETs with oxide semiconductor channels.
沟道材料、界面质量和极化对氧化物半导体无界面层ffet记忆窗的影响
本研究系统地研究了利用工程氧化物半导体材料、退火工艺和HZO中的极化对无界面层(IL)和Hfx $Zr_{{1}-{x}}$ O2 (HZO)基铁电场效应晶体管(fefet)中具有氧化物沟道的记忆窗口(MW)的调制。我们的研究结果表明,这种FeFET中的MW主要由半导体层的正电荷供应能力和铁电层与半导体之间的界面特性决定。具体地说,通道材料中较高的掺杂浓度和较少的界面捕获可以提高毫瓦。相反,极化效果有限。这些结果为具有氧化物半导体通道的效应场效应管中MW优化的潜在机制提供了重要的见解。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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