A Compact Model for Polarization-Graded HEMTs Demonstrating Enhanced Linearity

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Mohammad Sajid Nazir;Mir Mohammad Shayoub;Nivedhita Venkatesan;Patrick Fay;Yogesh Singh Chauhan
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引用次数: 0

Abstract

This article presents an approach for modeling polarization-graded gallium nitride (GaN) high-electron-mobility transistors (HEMTs). Unlike conventional GaN HEMTs, where a 2-D electron gas (2DEG) forms at the barrier–channel interface, graded structures feature a 3-D electron distribution. TCAD simulations are used to extract carrier density and energy band diagrams, which form the basis for model development. The derivation uses refined approximations for the Fermi–Dirac integral solution, ensuring differentiability while accurately correlating carrier density with the applied gate bias through the use of potential balance. A surface-potential-based approach is subsequently used to model terminal currents and charges. Validation of the model is done through comparison with on-wafer measurements and published data, including dc transfer and output characteristics and measured S-parameters over the frequency range of 10 MHz–110 GHz. Furthermore, model accuracy in representing linearity is verified by comparing to large signal and intermodulation measurements at 10 GHz.
偏振梯度hemt的紧凑模型显示增强线性
本文提出了一种模拟极化梯度氮化镓(GaN)高电子迁移率晶体管(hemt)的方法。与传统的氮化镓hemt不同,在势垒-通道界面形成二维电子气体(2DEG),梯度结构具有三维电子分布。TCAD模拟用于提取载流子密度图和能带图,这是模型开发的基础。推导使用了费米-狄拉克积分解的精细近似,确保了可微性,同时通过使用电位平衡精确地将载流子密度与应用的栅极偏置相关联。基于表面电位的方法随后被用于模拟终端电流和电荷。通过与晶片上的测量和公布的数据进行比较,验证了该模型,包括直流传输和输出特性以及在10 MHz-110 GHz频率范围内测量的s参数。此外,通过比较10 GHz的大信号和互调测量,验证了模型在表示线性度方面的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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