Amalgamated organic polymer of PVA/P(VDF-TrFE) as back gate dielectric in WS2 FET fabrication

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Arpita Roy, Biplob Mondal
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引用次数: 0

Abstract

2D WS2 channel combined with organic polymer dielectrics have garnered significant attention due to their promising applications in FETs, owing to their exceptional mechanical flexibility and cost-effective fabrication process. WS2 FETs with polymer dielectrics not only surpass the thermal constraints but also enable low-voltage operation, providing a notable advantage over traditional devices. Conventional SiO2 dielectrics often suffer from high oxide trap density, which adversely affects device performance. To address these issues, this study proposes the incorporation of a stack of low-k and high-k organic polymer dielectrics in WS2-FET fabrication, enabling low-voltage operation at room temperature. Polymer gate dielectrics have demonstrated a remarkable ability to enhance the efficiency of 2D WS2-FETs, contributing to the development of versatile and energy-efficient device architectures. This work demonstrates the fabrication and electrical characterization of WS2-FETs using a PVA/P(VDF-TrFE) organic polymer dielectric stack. The findings reveal that the few-layer WS2-FET structures exhibit a field-effect mobility (μFE) of ∼215.2 cm2/Vs and ION/IOFF current ratio of around ∼107.
聚乙烯醇/聚乙烯醇汞化有机聚合物(VDF-TrFE)作为WS2场效应晶体管的后门介电材料
结合有机聚合物电介质的二维WS2通道由于其卓越的机械灵活性和经济高效的制造工艺,在fet中具有广阔的应用前景,引起了人们的极大关注。具有聚合物介质的WS2 fet不仅超越了热限制,而且能够实现低电压工作,与传统器件相比具有显着的优势。传统的SiO2介电材料往往存在较高的氧化阱密度,这对器件性能产生不利影响。为了解决这些问题,本研究提出在WS2-FET制造中加入一堆低k和高k有机聚合物介电体,从而实现室温下的低压工作。聚合物栅极介质在提高二维ws2 - fet的效率方面表现出了显著的能力,有助于开发多用途和节能的器件架构。本工作演示了使用PVA/P(VDF-TrFE)有机聚合物介电层的ws2 - fet的制造和电学特性。研究结果表明,低层WS2-FET结构的场效应迁移率(μFE)为~ 215.2 cm2/Vs, ION/IOFF电流比约为~ 107。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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