Defects Passivation and Performance Enhancement of AlGaN/GaN HEMTs by Supercritical Hydrogen Treatment

IF 2.4 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
J. K. Lian;Y. Q. Chen;C. Liu;X. Y. Zhang
{"title":"Defects Passivation and Performance Enhancement of AlGaN/GaN HEMTs by Supercritical Hydrogen Treatment","authors":"J. K. Lian;Y. Q. Chen;C. Liu;X. Y. Zhang","doi":"10.1109/JEDS.2025.3589195","DOIUrl":null,"url":null,"abstract":"In this paper, supercritical hydrogen treatment is used to passivate the defects of normally-on type AlGaN/GaN high electron mobility transistors. By comparing the electrical characteristics of devices before and after the experiment, the treated devices have shown larger on-state current, a negative shift of threshold voltage and shorter gate-lag. In addition, the reliability of the devices before and after treatment is tested by applying a DC reverse bias stress to the gate and the result indicates that the treated devices show less degradation after RB stress. At the same time, through the low-frequency noise test, it is further verified that the defect density near the 2DEG channel reduced from <inline-formula> <tex-math>$1.25 \\times 10^{20}~ {\\mathrm {cm}}^{-3}{\\mathrm {eV}}^{-1}$ </tex-math></inline-formula> to <inline-formula> <tex-math>$8.94 \\times 10^{18}~ {\\mathrm {cm}}^{-3}{\\mathrm {eV}}^{-1}$ </tex-math></inline-formula>. Based on the above results, a physical model is proposed to demonstrate the passivation mechanism. The original passivation layer and AlGaN barrier layer have many dangling bond defects that can capture electrons and cause virtual gate effect. Supercritical hydrogen penetrates into the material substrate and passivates the dangling bonds. The result of this experiment provides a significant reference for the research of improving the reliability of AlGaN/GaN HEMTs.","PeriodicalId":13210,"journal":{"name":"IEEE Journal of the Electron Devices Society","volume":"13 ","pages":"625-629"},"PeriodicalIF":2.4000,"publicationDate":"2025-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11080297","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of the Electron Devices Society","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11080297/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this paper, supercritical hydrogen treatment is used to passivate the defects of normally-on type AlGaN/GaN high electron mobility transistors. By comparing the electrical characteristics of devices before and after the experiment, the treated devices have shown larger on-state current, a negative shift of threshold voltage and shorter gate-lag. In addition, the reliability of the devices before and after treatment is tested by applying a DC reverse bias stress to the gate and the result indicates that the treated devices show less degradation after RB stress. At the same time, through the low-frequency noise test, it is further verified that the defect density near the 2DEG channel reduced from $1.25 \times 10^{20}~ {\mathrm {cm}}^{-3}{\mathrm {eV}}^{-1}$ to $8.94 \times 10^{18}~ {\mathrm {cm}}^{-3}{\mathrm {eV}}^{-1}$ . Based on the above results, a physical model is proposed to demonstrate the passivation mechanism. The original passivation layer and AlGaN barrier layer have many dangling bond defects that can capture electrons and cause virtual gate effect. Supercritical hydrogen penetrates into the material substrate and passivates the dangling bonds. The result of this experiment provides a significant reference for the research of improving the reliability of AlGaN/GaN HEMTs.
超临界氢处理AlGaN/GaN hemt的缺陷钝化及性能增强
本文采用超临界氢处理方法钝化了常导型AlGaN/GaN高电子迁移率晶体管的缺陷。通过对比实验前后器件的电特性,处理后的器件具有较大的导通电流、阈值电压负移和较短的门滞后。此外,通过对栅极施加直流反向偏置应力来测试处理前后器件的可靠性,结果表明处理后的器件在RB应力后的退化较小。同时,通过低频噪声测试,进一步验证了2DEG通道附近缺陷密度由$1.25 \倍10^{18}~ {\ mathm {cm}}^{-3}{\ mathm {eV}}^{-1}$降至$8.94 \倍10^{18}~ {\ mathm {cm}}^{-3}{\ mathm {eV}}^{-1}$。基于上述结果,提出了一个物理模型来证明钝化机理。原始钝化层和AlGaN势垒层存在许多悬空键缺陷,这些缺陷可以捕获电子并产生虚门效应。超临界氢渗透到材料基体中,使悬垂键钝化。本实验结果为提高AlGaN/GaN hemt可靠性的研究提供了重要参考。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Journal of the Electron Devices Society
IEEE Journal of the Electron Devices Society Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
5.20
自引率
4.30%
发文量
124
审稿时长
9 weeks
期刊介绍: The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信