Detection Limit of Defect-Induced Strain in GaN Evaluated by Valence EELS and Correlated Structural Analysis.

IF 1.9
Shunsuke Yamashita, Jun Kikkawa, Susumu Kusanagi, Ichiro Nomachi, Ryoji Arai, Yuya Kanitani, Koji Kimoto, Yoshihiro Kudo
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Abstract

Crystal defects are intrinsically linked to the electrical and optical properties of semiconductor materials, making their nanoscale detection essential across all phases (from research and development to manufacturing). Electron energy loss spectroscopy (EELS) in scanning transmission electron microscopy (STEM) has emerged as a promising technique for detecting even point defects due to the shape modulation in valence-loss spectra induced by defects. However, previous studies have primarily focused on qualitative detection, leaving the detection limit, ie, the minimum detectable concentration, insufficiently explored. To experimentally evaluate the detection limit of defects and clarify the application scope of valence EELS, we prepared GaN samples with controlled defect concentrations along the depth direction using multi-step He-ion implantation and acquired valence-loss spectra at each depth. Based on the simulated depth profile of defects, we evaluated the detection limit from the depth at which significant modulation in the spectral shape was observed. The detection limit fundamentally depends on the signal-to-noise ratio of the valence-loss spectra. Under typical STEM conditions with an electron dose of 5 × 105 e-/Å2, the detection limit of defects in GaN was determined to be 0.35% (3500 ppm). Detailed structural analysis revealed that GaN contains implantation-induced defects and their clusters, and exhibits lattice strain and local disorder while retaining its wurtzite structure. The shape modulation in the valence-loss spectra was attributed to the indirect detection of defects through the surrounding strain fields. We investigated the detection limit of defect-induced strain in GaN using valence EELS and correlated structural analysis. The detection limit fundamentally depends on the signal-to-noise ratio of the valence-loss spectra and was determined to be 0.35% (3500 ppm) under a typical STEM electron dose condition. Mini Abstract Figure: Figure 2 and 3.

用价态EELS和相关结构分析评价GaN中缺陷诱发应变的检测限。
晶体缺陷与半导体材料的电学和光学特性有着内在的联系,这使得它们的纳米级检测在所有阶段(从研发到制造)都是必不可少的。扫描透射电子显微镜(STEM)中的电子能量损失谱(EELS)由于缺陷引起的价损失谱的形状调制而成为一种很有前途的检测偶点缺陷的技术。然而,以往的研究主要集中在定性检测上,而对检测限(即最低可检测浓度)的探索不足。为了实验评估缺陷的检测极限,明确价态EELS的应用范围,我们采用多步he离子注入制备了沿深度方向控制缺陷浓度的GaN样品,并获得了每个深度的价态损失谱。基于模拟的缺陷深度轮廓,我们从观察到光谱形状显著调制的深度评估了检测极限。检测极限基本上取决于价损谱的信噪比。在典型的STEM条件下,电子剂量为5 × 105 e-/Å2, GaN中缺陷的检测限为0.35% (3500 ppm)。详细的结构分析表明,GaN在保留纤锌矿结构的同时,含有植入缺陷及其团簇,表现出晶格应变和局部无序。价损谱中的形状调制归因于通过周围的应变场间接检测缺陷。我们利用价态EELS和相关结构分析研究了GaN中缺陷诱导应变的检测限。检出限基本上取决于价损谱的信噪比,在典型的STEM电子剂量条件下确定为0.35% (3500 ppm)。迷你摘要图:图2和图3。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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