Xin Lin , Taifu Lang , Chang Lin , Yujie Xie , Xiaowei Huang , Xuehuang Tang , Shuaishuai Wang , Xueqi Zhu , Zhonghang Huang , Tianxi Yang , Kaixin Zhang , Jie Sun , Qun Yan
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引用次数: 0
Abstract
This paper presents an ultra-high yield Micro-LED pixel transfer method without residual polymer. The approach is based on a laser transfer scheme, combined with data grouping and an empirical relationship. These strategies effectively address the fundamental yield challenges in Micro-LEDs, which arise from the difficulty of transferring a large number of devices. Initially, we identified the issues of chip damage and missing during the laser transfer process and analyzed the underlying causes by the preparation process. Subsequently, the optimal process conditions were determined. An empirical relationship was also established. In addition, the effects of laser energy, laser spot size, and chip subsidence depth on Micro-LED stripping and transfer performance were analyzed. The results indicate that the chip retention rate is at its highest when the energy density of the controlled laser lift-off is within the range of 1200-1500mJ/cm2. Additionally, the secondary transfer yield was 100 % when the energy density of the laser transfer and the depth of the chip subsidence satisfied empirical relationship, and the laser spot size was 30 μm × 38 μm. The preparatory process is highly reproducible and provides a robust foundation for subsequent laser transfer. Furthermore, it offers a significant reference for advancing the critical technologies involved in Micro-LED mass production.
期刊介绍:
Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication.
The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas:
•development in all types of lasers
•developments in optoelectronic devices and photonics
•developments in new photonics and optical concepts
•developments in conventional optics, optical instruments and components
•techniques of optical metrology, including interferometry and optical fibre sensors
•LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow
•applications of lasers to materials processing, optical NDT display (including holography) and optical communication
•research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume)
•developments in optical computing and optical information processing
•developments in new optical materials
•developments in new optical characterization methods and techniques
•developments in quantum optics
•developments in light assisted micro and nanofabrication methods and techniques
•developments in nanophotonics and biophotonics
•developments in imaging processing and systems