RESURF Ga2O3-on-SiC Field Effect Transistors for Enhanced Breakdown Voltage

IF 2 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Junting Chen;Xiaohan Zhang;Junlei Zhao;Jin Wei;Mengyuan Hua
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Abstract

Heterosubstrates have been extensively studied as a method to improve the heat dissipation of Ga2O3 devices. In this simulation work, we propose a novel role for p-type available heterosubstrates, as a component of a reduced surface field (RESURF) structure in Ga2O3 lateral field-effect transistors (FETs). The RESURF structure can eliminate the electric field crowding and contribute to higher breakdown voltage. Using SiC as an example, the designing strategy for doping concentration and dimensions of the p-type region is systematically studied using TCAD modeling. Meanwhile, the interface charges and Al2O3 interlayer that could exist in realistic devices are mimicked in the simulation. Additionally, the feasibility of the RESURF structure for high-frequency switching operation is supported by the simulation on charging/discharging time the p-SiC depletion region. This study demonstrates the great potential of utilizing the electrical properties of heat-dissipating heterosubstrates to achieve a uniform electric field distribution in Ga2O3 FETs.
用于提高击穿电压的复用Ga2O3-on-SiC场效应晶体管
异质衬底作为一种改善Ga2O3器件散热的方法已经得到了广泛的研究。在这项模拟工作中,我们提出了p型可用异质衬底的新作用,作为Ga2O3横向场效应晶体管(fet)中减少表面场(RESURF)结构的组成部分。该结构可以消除电场拥挤,提高击穿电压。以SiC为例,采用TCAD模型系统地研究了掺杂浓度和p型区尺寸的设计策略。同时,模拟了实际器件中可能存在的界面电荷和Al2O3中间层。此外,对p-SiC耗尽区充放电时间的模拟也支持了该结构用于高频开关操作的可行性。这项研究证明了利用散热异质衬底的电学特性在Ga2O3场效应管中实现均匀电场分布的巨大潜力。
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来源期刊
IEEE Journal of the Electron Devices Society
IEEE Journal of the Electron Devices Society Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
5.20
自引率
4.30%
发文量
124
审稿时长
9 weeks
期刊介绍: The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.
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