A physics-based electromigration model for advanced interconnects

IF 1.6 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Reliability Pub Date : 2025-07-10 DOI:10.1016/j.microrel.2025.115862

Wangyong Chen , Binyu Yin , Linlin Cai , Yi Wan

引用次数: 0

Abstract

Electromigration (EM) prediction is becoming more significant for advanced back-end-of-line. In this work, we propose a physics-based EM model to achieve the high-accuracy and high-efficiency assessment for time-to-failure (TTF). The void evolution is considered during the EM degradation which includes the resistivity model, temperature model and activation energy correction model. The proposed model enables to depict the resistance degradation curves over time which agrees well with the experiment data. The influence of dimension, grain size, temperature, and current density on TTF of interconnects can be analyzed by the model, showing a potential application for fast EM prediction in high-density integration, especially for the advanced interconnects.

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基于物理的高级互连电迁移模型

电迁移（EM）预测在先进的后端线路中变得越来越重要。在这项工作中，我们提出了一种基于物理的电磁模型，以实现高精度和高效率的故障时间（TTF）评估。考虑了电磁退化过程中孔隙的演化，包括电阻率模型、温度模型和活化能修正模型。该模型能较好地描述电阻随时间的衰减曲线，与实验数据吻合较好。通过该模型可以分析尺寸、晶粒尺寸、温度和电流密度对互连体TTF的影响，显示了在高密度集成，特别是高级互连体中快速EM预测的潜在应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Reliability 工程技术-工程：电子与电气

CiteScore

3.30

自引率

12.50%

发文量

342

审稿时长

68 days

期刊介绍： Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.