Three-Dimensional Low-Loss Power-Dividing Networks Based on Metal Integrated Suspended Line (MISL) for High Power Applications

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-31 DOI:10.1109/TCPMT.2025.3556254

Hanyong Wang;Yongqiang Wang;Kaixue Ma

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Abstract

In this article, the transmission characteristics of metal integrated suspended line (MISL) technology are studied which is verified by the thru-reflect-line (TRL) de-embedding method. In addition, practical design guidelines for MISL circuits are provided. A 3-D T-junction power-dividing network is introduced. Furthermore, a 3-D Gysel power-dividing network is designed based on the proposed T-junction power-dividing network. Both networks exhibit low-loss performance. They also have a higher power handling capability (PHC) than traditional printed circuit board (PCB). In contrast to waveguide circuits, they utilize multilayer metal stacking, have the characteristics of quasi-planar circuits, and reduce the manufacturing cost. Moreover, compared with the substrate-integrated suspended line (SISL) circuits, the MISL technology reduces the number of circuit layers by combining computer numerical control (CNC) machining with laser and etching technologies, simplifying assembly processes.

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基于金属集成悬吊线（MISL）的高功率三维低损耗分网

本文研究了金属集成悬索线（MISL）技术的传输特性，并用透反射线（TRL）脱埋法对其进行了验证。此外，还提供了MISL电路的实用设计指南。介绍了一种三维t结分功网络。在此基础上，设计了三维Gysel分路网络。两种网络都表现出低损耗性能。它们还具有比传统印刷电路板（PCB）更高的功率处理能力（PHC）。与波导电路相比，它们利用多层金属堆叠，具有准平面电路的特性，并且降低了制造成本。此外，与基板集成悬浮线（SISL）电路相比，MISL技术通过将计算机数控（CNC）加工与激光和蚀刻技术相结合，减少了电路层数，简化了装配过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.