High-Selectivity Bandpass Filter in Glass Substrate RDL for Millimeter-Wave Applications

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-03-27 DOI:10.1109/TCPMT.2025.3574071

Yanzhu Qi;Bo Yuan;Yazi Cao;Shichang Chen;Kanglong Zhang;Gaofeng Wang

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引用次数: 0

Abstract

A highly selective bandpass filter (BPF) utilizing branch-loaded resonators (BLRs) is presented. The filter is implemented using a redistribution layer (RDL) based on a glass substrate. It consists of four unitized BLRs with electric and magnetic couplings between the resonators. By adjusting the size and couplings of BLR, the passband and four transmission zeros (TZs) of BPF can be readily controlled. An equivalent circuit is proposed and discussed to illustrate the working principle. To validate the design, a BPF prototype with a center frequency of 21 GHz is fabricated and tested. The measured results indicate that the fabricated BPF has a 3-dB fractional bandwidth of 15%. A roll-off of 7.17 dB/GHz is achieved in the low sideband, while a roll-off of 3.44 dB/GHz in the high sideband, resulting in sharp-rejection filtering. Over 30 dB of suppression is achieved from 0 to 15.65 GHz, while over 27 dB from 29.4 to 50 GHz. Including the pads, the fabricated BPF has a compact size of

$0.185\times 0.151~\lambda g$

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用于毫米波应用的玻璃基板RDL高选择性带通滤波器

提出了一种基于分支负载谐振器的高选择性带通滤波器（BPF）。该滤波器使用基于玻璃基板的再分配层（RDL）实现。它由四个单元blr组成，谐振器之间有电和磁耦合。通过调整BLR的尺寸和耦合，可以很容易地控制BPF的通带和四个传输零点。提出并讨论了一个等效电路来说明其工作原理。为了验证该设计，制作了中心频率为21 GHz的BPF样机并进行了测试。测量结果表明，所制备的BPF具有15%的3db分数带宽。在低边带实现了7.17 dB/GHz的滚降，而在高边带实现了3.44 dB/GHz的滚降，从而实现了锐阻滤波。在0 ~ 15.65 GHz范围内可实现30 dB以上的抑制，而在29.4 ~ 50 GHz范围内可实现27 dB以上的抑制。包括焊盘在内，制备的BPF具有紧凑的尺寸为0.185\乘以0.151~\lambda g$。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.