Comparison of Output Characteristics of Vanadium-Compensated 4H-SiC PCSS at 1064 nm and 355 nm

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Fuyin Liu;Ripin Wang;Ting He;Bohan Li;Yuchen Liu;Muyu Yi;Langning Wang;Tao Xun
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引用次数: 0

Abstract

This letter investigates the differences in output characteristics of planar 4H-SiC photoconductive semiconductor switches (PCSS) at 355 nm and 1064 nm. Microwave experiments in the range of 0-2 GHz were conducted to test the response time of the PCSS. The modulation depth of microwave triggered by 355 nm is found to be slightly inferior to that triggered by 1064 nm. The comparative analysis of carrier lifetime calculations and two-dimensional numerical simulations reveal that the disparity between electron and hole lifetimes significantly contributes to the distinct response time between 355 nm and 1064 nm Under a bias electric field of 20 kV/mm, the photoelectric conversion efficiency of the device triggered by 355 nm is 54 times that of the device triggered by 1064 nm, and the power capacity can reach 1.36 MW.
钒补偿4H-SiC PCSS在1064 nm和355 nm输出特性的比较
本文研究了平面4H-SiC光导半导体开关(PCSS)在355 nm和1064 nm下输出特性的差异。在0 ~ 2 GHz范围内进行了微波实验,测试了PCSS的响应时间。355 nm触发的微波调制深度略低于1064 nm触发的微波调制深度。载流子寿命计算和二维数值模拟的对比分析表明,电子寿命和空穴寿命的差异对355nm和1064nm之间的响应时间差异有显著影响,在20kv /mm偏置电场下,355nm触发器件的光电转换效率是1064nm触发器件的54倍,功率容量可达到1.36 MW。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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